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Report
Plastics in Electronics Components: Technologies and Global Markets
Market Research Report I 2023-02-23 I 218 Pages I BCC Research
Description
Report Scope:
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding compression molding, and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures. The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.
Report Includes:
- 61 data tables and 23 additional tables
- An overview of the global markets and technologies for plastics in electronics components
- Analyses of the global market trends, with data for 2022, 2023 and projections of compound annual growth rates (CAGRs) through 2028
- Estimation of the market size and revenue forecast for plastics in electronics components, and market share analysis by type, end-user, and region
- Highlights of the market opportunities, and major issues and trends affecting the plastic industry
- Insight into the recent industry structure, regulations and policies, pipeline products, and the vendor landscape of the market leading participants
- Company profiles of major players within the industry, including BASF, Covestro AG, Henkel AG, Mitsubishi Engineering-Plastics Corp., and SABIC
Executive Summary
Summary:
From the early days of valves to the creation of the transistor and later the integrated circuit, much of the progress made by the electronics industry towards ever-greater miniaturization has only been made possible due to the availability of different polymeric materials. The development of numerous novel plastics expressly for use in electrical and electronic device applications has led to the ongoing growth of both the electronics and plastics sectors. Electronics components have seen a large drop in real cost performance over time. This decline can be partially attributable to the availability and performance of novel polymeric materials. A specific example is the development of the personal computer, where
advancements in polymer-based photoresists and plastic encapsulation techniques have made it possible to mass produce high-density memories and microprocessors at a price that makes devices more potent than mainframe computers of thirty years ago available for barely more than the cost of a toy. The creation of electrical and electronic equipment today uses a variety of plastic materials extensively, from insulator moldings for the largest bushings and transformers to alpha particle barriers on memory devices. Plastics, or more precisely polymers, are used in a variety of applications including equipment casings, protective coatings, wire and cable insulators, printed circuit board components,
die-to-attach adhesives, and packaging for individual microcircuits.
The electronics sector is a significant user of high-performance thermoplastic and thermosetting polymers. Almost all engineering thermoplastics (ETPs) are used in some form of electronics component, but standard nylons (polyamides) and thermoplastic polyesters (typically polybutylene terephthalate) are by far the two most common polymer families. This is particularly true among connectors, which make up the majority of the market for electronic components. Even as the average size of each component used continues to shrink and wall thicknesses can be reduced thanks to advancements in polymer processability and end-use performance, the consumption of engineering thermoplastics in this industry is rising as the use of electronic devices permeates more areas of our working and leisure lives.
ETPs are frequently viewed as commodities by specifiers, particularly in certain types of connectors, and the choice of material is likely influenced by cost as much as by performance. This is much less of an issue in higher-performance applications, but even in these markets, suppliers of high-temperature nylons (a class that includes nylons 46, 4T and polyphthalamides) compete with those of polyphenylene sulfide (PPS), liquid crystal polymers (LCPs), and other polymer types. LCPs are a specific type of thermoplastic polyester. Different varieties of polyaryletherketone, the most prevalent of which is polyetheretherketone, are still further up the performance ladder.
In the market for electronic components, polyimides occupy a certain niche. They are mostly utilized in film form for flexible electronics and come in thermoset and thermoplastic varieties. When thermal stability is not a concern, they encounter some competition from films made of various forms of polyester (polyethylene terephthalate and, to a lesser extent, polyethylene naphthalate). This particular submarket is now expanding quickly.
Table of Contents
Chapter 1 Introduction
1.1 Study Goals and Objectives
1.2 Reasons for Doing This Study
1.3 Scope of Report
1.4 What's New in This Report?
1.5 Information Sources
1.6 Methodology
1.7 Geographic Breakdown
1.8 Analyst's Credentials
1.9 BCC Custom Research
1.10 Related BCC Research Reports
Chapter 2 Summary and Highlights
Chapter 3 Market and Technology Background
3.1 Overview
3.2 Snapshot of the Electronic Device Market
3.3 Computers
3.3.1 Overview
3.3.2 Desktops
3.4 Electronic Displays
3.4.1 Background
3.5 Printers
3.5.1 Overview
3.5.2 Inkjet Printers
3.5.3 Monochrome Laser Printers
3.5.4 Color Laser Printers
3.5.5 Manufacturers
3.6 "All-in-One" Machines
3.7 Phones
3.7.1 Corded
3.7.2 Cordless
3.8 Fax Machines
3.9 Scanners
3.10 Mobile Electronics Devices
3.10.1 Phones
3.10.2 Laptops/Notebooks/Netbooks
3.10.3 Tablets
3.10.4 E-Readers
3.10.5 Portable Music Players
3.11 Automotive Market
3.11.1 Overview
3.11.2 Electric Cars
3.11.3 CAFE Issues
3.11.4 Overview of Electronic Components in Automotive Products
3.11.5 Flexible Circuitry in Automotive Applications
Chapter 4 Market Breakdown by Technology Type
4.1 Overview
4.2 Types of Polymers
4.3 Thermoplastics
4.3.1 Standard Nylons
4.3.2 Thermoplastic Polymers
4.3.3 Polyphenylene Sulfide
4.3.4 Polyimides
4.3.5 Polycarbonates
4.3.6 Polyphthalamides and Other High-Temperature Nylons
4.3.7 Liquid Crystal Polymers
4.3.8 Sulfone Polymers
4.3.9 Alloys/Blends
4.3.10 Fluoropolymers
4.3.11 Polyaryletherketones
4.3.12 Cyclic Olefin Copolymers
4.3.13 Thermoplastic Market Estimates and Forecasts Summary
4.4 Thermoset Polymers
4.4.1 Overview
4.4.2 General Properties
4.4.3 Epoxy Resins
4.4.4 Polyurethanes
4.4.5 Phenolics
4.4.6 Unsaturated Polyesters
4.4.7 Diallyl Phthalate
4.4.8 BT-Epoxy Resins and Cyanate Esters
4.4.9 Thermoset Market Estimates and Forecasts Summary
Chapter 5 Overview of Key Components, PCBs and Encapsulants
5.1 Introduction
5.2 The Focus of This Report
5.3 Resin Consumption
5.3.1 Background
5.3.2 Markets
5.3.3 Growth
5.3.4 Market Drivers
5.4 Printed Circuit Boards
5.4.1 Overview
5.4.2 Property Requirements for Laminates
5.4.3 Physical Composition
5.4.4 Assembly Technologies
5.4.5 PCB Substrates
5.4.6 Specific Polymers Used in Printed Circuit Boards
5.4.7 Other Materials Used in Printed Circuit Boards
5.4.8 Fiber Reinforcements
5.4.9 Production of Circuitry
5.4.10 Environmental Issues
5.4.11 Flexible Printed Circuit Boards
5.4.12 Soldering
5.4.13 Production Statistics
5.4.14 Industry Trends
5.4.15 Electronics Packaging
5.4.16 Market Estimates and Forecasts
5.5 Encapsulants
5.5.1 Definitions and Background
5.5.2 Primary Purposes of Encapsulation
5.5.3 Encapsulant Materials
5.5.4 Epoxy Encapsulation Formulations
5.5.5 Encapsulated Electrical and Electronic Components
5.5.6 Epoxy Encapsulant Systems
5.5.7 Silicone Encapsulants
5.5.8 Thermoplastic Encapsulants
5.5.9 Selected Major Encapsulant Producers and Their Product Lines
5.5.10 Market Estimates and Forecasts
Chapter 6 Molded Electronic Products
6.1 Overview
6.1.1 Background
6.1.2 Polymers Used
6.1.3 Market Drivers
6.2 Connectors
6.2.1 Background
6.2.2 Functions and Components of Connectors
6.2.3 Trends
6.2.4 Applications for Electronic Connectors
6.2.5 Material Selection
6.2.6 Flame Retardance
6.2.7 Standards Relating to Connectors
6.2.8 Manufacturers
6.2.9 End-Use Markets
6.2.10 Market Estimates and Forecasts
6.3 Switches
6.3.1 Background
6.3.2 Market Estimates and Forecasts
6.4 Coil Formers
6.4.1 Background
6.4.2 Manufacturers
6.4.3 Market Estimates and Forecasts
6.5 Relays
6.5.1 Background
6.5.2 Market Estimates and Forecasts
6.6 Capacitors
6.6.1 Background
6.6.2 Applications
6.6.3 Capacitor Materials
6.6.4 Consumption by Market Segment
6.6.5 Market Estimates and Forecasts
6.7 Other Types of Molded Electronic Components
6.7.1 Resistors
6.7.2 Market Estimates and Forecasts
6.8 Summary of Market Estimates and Forecasts
Chapter 7 New Developments
7.1 Background
7.2 Importance of Miniaturization
7.2.1 High-density Interconnect Technology to Drive Market for PCB
7.3 Thin-Walling Electronic Components
7.3.1 Background
7.3.2 Effects of Thin-Walling on Performance Requirements and Design
7.3.3 Application Requirements
7.3.4 Material and Process Selection
7.3.5 Properties Required
7.3.6 Challenges in Downsizing
7.3.7 Software that Aids Thin-wall Design
7.4 Flexible Electronics
7.4.1 Overview
7.5 Wearable Electronics
7.6 Cloud Computing and Big Data
7.7 The Internet of Everything
7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices
7.9 Recent Patents Related to the Industry
Chapter 8 Electronic Component Industry Overview and Plastics Producers
8.1 Top Semiconductor Producers and Customers
8.2 Manufacturing and Marketing Aspects
8.2.1 Globalization
8.2.2 What Component Suppliers Are Doing
8.3 Plastics Producers
8.3.1 Overview
8.4 Polymer Producers According to Material Type
8.4.1 Thermosets
8.4.2 Thermoplastics
Chapter 9 Environmental Issues
9.1 Overview
9.2 Printed Circuit Board Disposal
9.3 Bromine-Free Printed Circuit Boards
9.4 Halogen-Free Flame Retardants for Thermoplastics
9.5 Recycling
9.6 Electronics Industry Interface
9.6.1 Overview
9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment
9.6.3 The European Union RoHS Directive
9.6.4 The European Union WEEE Directive
9.6.5 EPEAT
Chapter 10 Performance Requirements Related to Electronic Components
10.1 Overview
10.2 Flammability Standards
10.2.1 Definitions
10.3 Flammability Tests
10.3.1 Overview
10.3.2 UL 94
10.3.3 Glow-Wire Flammability Index - IEC 60695
10.3.4 UL 1694
10.3.5 UL 746C
10.4 Other Standards
10.4.1 UL 1446
10.4.2 UL 1950
Chapter 11 Competitive Landscape
11.1 Overview
11.2 Big Brands Engineer the Potential of Thermoplastics
11.3 Key Developments
11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components
Chapter 12 Company Profiles
ASAHI KASEI CORP.
ASHLAND INC.
BASF
CELANESE
COVESTRO AG
CYTEC INDUSTRIES INC.
DSM
DUPONT DE NEMOURS AND CO.
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN INTERNATIONAL LLC
INTERPLASTIC CORP.
KINGFA SCIENCE AND TECHNOLOGY CO. LTD.
LANXESS AG
MITSUBISHI ENGINEERING-PLASTICS CORP.
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX PLC
Chapter 13 Appendix: Acronyms
List of Tables
Summary Table : Global Market for Plastics Used in Electronic Components, by Type of Polymer, Through 2027
Table 1 : Examples of Standard Nylons Used to Mold Electronic Components, by Trade Name
Table 2 : Global Market for Standard Nylon Electronic Components, by Application, Through 2027
Table 3 : Examples of Polybutylene Terephthalates Used to Mold Electronic Components, by Trade Name
Table 4 : Global Market for PBT Electronic Components, by Application, Through 2027
Table 5 : Global Market for PET/PCT Electronic Components, by Application, Through 2027
Table 6 : Examples of Polyphenylene Sulfide and Polyphenylene Sulfide Blends Used to Mold Electronic Components, by Trade Name
Table 7 : Global Market for Polyphenylene Sulfide Electronic Components, by Application, Through 2027
Table 8 : Global Market for Polyimide* Electronic Components, by Application, Through 2027
Table 9 : Examples of Polycarbonates Used to Mold Electronic Components, by Trade Name
Table 10 : Global Market for Polycarbonate Electronic Components, by Application, Through 2027
Table 11 : Examples of Polyphthalamide Polymers used to Mold Electronic Components, by Trade Name
Table 12 : Global Market for Polyphthalamides and High-Temperature Nylon Electronic Components, by Application, Through 2027
Table 13 : Examples of Liquid Crystal Polymers Used to Mold Electronic Components, by Trade Name
Table 14 : Global Market for Liquid Crystal Polymer Electronic Components, by Application, Through 2027
Table 15 : Global Market for Sulfone Polymer Electronic Components, by Application, Through 2027
Table 16 : Global Market for Polymer Alloy/Blend Electronic Components, by Application, Through 2027
Table 17 : Global Market for Fluoropolymer Electronic Components, by Application, Through 2027
Table 18 : Examples of PAEK Used to Mold Electronic Components, by Trade Name
Table 19 : Global Market for Polyaryletherketone Electronic Components, by Application, Through 2027
Table 20 : Global Market for Thermoplastic Electronic Components, by Type, Through 2027
Table 21 : Thermoset Properties and Manufacturing Processes
Table 22 : Examples of Epoxy Resins Used for Electronic Components, by Trade Name
Table 23 : Global Market for Epoxy Resin Electronic Components, by Application, Through 2027
Table 24 : Examples of Polyurethane Systems Used for Electronic Components, by Trade Name
Table 25 : Global Market for Polyurethane Electronic Components, by Application, Through 2027
Table 26 : Examples of Phenolics Used for Electronic Components, by Trade Name
Table 27 : Global Market for Phenolic Electronic Components, by Application, Through 2027
Table 28 : Examples of Unsaturated Polyester and Vinyl Ester and Compounds Used for Electronic Components, by Trade Name
Table 29 : Global Market for Unsaturated Polyester Electronic Components, by Application, Through 2027
Table 30 : Global Market for Diallyl Phthalate Electronic Components, by Application, Through 2027
Table 31 : Global Market for Thermoset Electronic Components, by Type, Through 2027
Table 32 : Important Technical Factors to Consider When Selecting Printed Circuit Board Substrate Materials
Table 33 : Comparison between Rigid and Flexible Circuit Boards
Table 34 : Major Producers of Rigid and Flexible Circuit Boards
Table 35 : Polymers Suitable for Production of 3D-MIDs Using LDS Technology
Table 36 : Advantages and Disadvantages of LDS and Two-component Molding for 3D-MIDs
Table 37 : Global Market for PCB, by Polymer Type, Through 2027
Table 38 : Global Market for PCB*, by Thermoplastic Type, Through 2027
Table 39 : Global Market for PCB, by Thermoset Type, Through 2027
Table 40 : Types of Encapsulant Materials-Advantages and Disadvantages
Table 41 : Epoxy Encapsulant Formulations
Table 42 : Global Market for Encapsulants, by Polymer Type, Through 2027
Table 43 : Global Market for Encapsulants, by Thermoplastic Type, Through 2027
Table 44 : Global Market for Encapsulants, by Thermoset Type, Through 2027
Table 45 : Major Manufacturers of Electronic Connectors
Table 46 : Global Market for Electronic Connectors, by Polymer Type, Through 2027
Table 47 : Global Market for Electronic Connectors, by Thermoplastic Type, Through 2027
Table 48 : Global Market for Electronic Connectors, by Thermoset Type, Through 2027
Table 49 : Global Market for Electronic Switches, by Polymer Type, Through 2027
Table 50 : Global Market for Electronic Switches, by Thermoplastic Type, Through 2027
Table 51 : Global Market for Electronic Switches, by Thermoset Type, Through 2027
Table 52 : Selected Manufacturers Molding Coil Formers for Electronics Applications
Table 53 : Global Market for Electronic Coil Formers, by Polymer Type, Through 2027
Table 54 : Global Market for Electronic Coil Formers, by Thermoplastic Type, Through 2027
Table 55 : Global Market for Electronic Coil Formers, by Thermoset Type, Through 2027
Table 56 : Global Market for Electronic Relays, by Polymer Type, Through 2027
Table 57 : Global Market for Electronic Relays, by Thermoplastic Type, Through 2027
Table 58 : Global Market for Electronic Relays, by Thermoset Type, Through 2027
Table 59 : Global Market for Electronic Capacitors, by Thermoplastic Type, Through 2027
Table 60 : Global Market for Other Types of Electronic Components, by Polymer Type, Through 2027
Table 61 : Global Market for Other Types of Electronic Components, by Thermoplastic Type, Through 2027
Table 62 : Global Market for Other Types of Electronic Components, by Thermoset Type, Through 2027
Table 63 : Global Market for Electronic Components, by Application, Through 2027
Table 64 : Global Market for Thermoplastic Electronic Components, by Application, Through 2027
Table 65 : Global Market for Thermoset Electronic Components, by Application, Through 2027
Table 66 : Top Global Semiconductor Producer Companies, 2020
Table 67 : Trade Names of Selected Plastics Used in Electronic Components
Table 68 : Developments in the Market for Plastics in Electronic Components, 2020-2022
Table 69 : Asahi Kasei Corp.: Financials, 2020 and 2021
Table 70 : BASF: Financials, 2020 and 2021
Table 71 : Celanese: Financials, 2020 and 2021
Table 72 : Covestro AG: Financials, 2020 and 2021
Table 73 : DSM: Financials, 2020 and 2021
Table 74 : DuPont: Financials, 2020 and 2021
Table 75 : EMS Group: Financials, 2020 and 2021
Table 76 : Henkel AG: Financials, 2020 and 2021
Table 77 : Huntsman International LLC.: Financials, 2020 and 2021
Table 78 : Lanxess AG: Financials, 2020 and 2021
Table 79 : Mitsubishi Engineering-Plastics Corp.: Financials, 2021 and 2022
Table 80 : SABIC: Financials, 2020 and 2021
Table 81 : Solvay: Financials, 2020 and 2021
Table 82 : Toray Plastics: Financials, 2020 and 2021
Table 83 : Victrex plc: Financials, 2020 and 2021
List of Figures
Summary Figure : Global Market for Plastics Used in Electronic Components, by Type of Polymer, 2021-2027
Figure 1 : Key Developments
Figure 2 : Asahi Kasei Corp.: Global Sales Share, by Segment, 2021
Figure 3 : Asahi Kasei Corp.: Global Sales Share, by Country/Region, 2021
Figure 4 : BASF: Global Sales Share, by Segment, 2021
Figure 5 : BASF: Global Sales Share, by Region, 2021
Figure 6 : Celanese: Global Sales Share, by Segment, 2021
Figure 7 : Celanese: Global Sales Share, by Country/Region, 2021
Figure 8 : Covestro AG: Global Sales Share, by Segment, 2021
Figure 9 : Covestro AG: Global Sales Share, by Country/Region, 2021
Figure 10 : DuPont: Global Sales Share, by Segment, 2021
Figure 11 : DuPont: Global Sales Share, by Country/Region, 2021
Figure 12 : EMS Group: Global Sales Share, by Segment, 2021
Figure 13 : EMS Group: Global Sales Share, by Region, 2021
Figure 14 : Henkel AG: Global Sales Share, by Segment, 2021
Figure 15 : Henkel AG: Global Sales Share, by Region, 2021
Figure 16 : Huntsman International LLC.: Global Sales Share, by Segment, 2021
Figure 17 : Huntsman International LLC.: Global Sales Share, by Region, 2021
Figure 18 : Lanxess AG: Global Sales Share, by Segment, 2021
Figure 19 : Lanxess AG: Global Sales Share, by Country/Region, 2021
Figure 20 : Mitsubishi Engineering-Plastics Corp.: Global Sales Share, by Country/Region, 2022
Figure 21 : SABIC: Global Sales Share, by Segment, 2021
Figure 22 : SABIC: Global Sales Share, by Country/Region, 2021
Figure 23 : Solvay: Global Sales Share, by Segment, 2021
Figure 24 : Solvay: Global Sales Share, by Region, 2021
Figure 25 : Toray Plastics: Global Sales Share, by Segment, 2021
Figure 26 : Victrex plc: Global Sales Share, by Segment, 2021
Figure 27 : Victrex plc: Global Sales Share, by Region, 2021
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