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Report
NA Semiconductor Manufacturing Equipment Market - Industry Trends and Forecast to 2030
Market Report I 2022-11-01 I 188 Pages I Data Bridge Market Research
The semiconductor manufacturing equipment market is projected to register a CAGR of 9.5% in the forecast period of 2023 to 2030. The new market report contains data for historic year 2021, the base year of calculation is 2022 and the forecast period is 2023 to 2030.
Market Segmentation:
North America Semiconductor Manufacturing Equipment Market, By Equipment Type (Front End Equipment, and Back End Equipment), Dimensions (3D, 2.5D, and 2D), Product Type (Memory, MEMS, Foundry, Analog, MPU, Logic, Discrete, and Others), Supply Chain Participant (Integrated Device Manufacturer (IDM) Firms, Foundry, and Outsourced Semiconductor Assembly and Test (OSAT) Companies), Fab Facility Equipment (Factory Automation, Gas Control Equipment, Chemical Control Equipment, and Others) Country (U.S., Canada and Mexico in North America) Industry Trends and Forecast to 2030
Some of the major factors contributing to the growth of the semiconductor manufacturing equipment market are:
- Increasing consumption of consumer electronics
- Growing demand for semiconductor across the globe
Market Players
Some of the major players operating in the semiconductor manufacturing equipment market are:
- ASML, K.L.A
- Corporation.
- Plasma-Therm
- LAM RESEARCH CORPORATION.
- Veeco Instruments Inc.
- E.V. Group
- Tokyo Electron Limited
- Canon Machinery Inc.
- Nordson Corporation
- Hitachi High-Tech Corporation
- Advanced Dicing Technologies.
- Evatec AG.
- NOIVION
- Modutek.com
- QP Technologies
- Applied Materials, Inc.
- SCREEN Holdings Co., Ltd.
- Teradyne Inc.
- Onto Innovation
- ADVANTEST CORPORATION
- TOKYO SEIMITSU CO., LTD.
- SUSS MicroTec SE
- ASMPT
- FormFactor
- UNITES Systems a.s.
- Gigaphoton Inc.
- Palomar Technologies
TABLE OF CONTENTS
1 INTRODUCTION 40
1.1 OBJECTIVES OF THE STUDY 40
1.2 MARKET DEFINITION 40
1.3 OVERVIEW OF THE NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 40
1.4 CURRENCY AND PRICING 42
1.5 LIMITATIONS 42
1.6 MARKETS COVERED 42
2 MARKET SEGMENTATION 46
2.1 MARKETS COVERED 46
2.2 GEOGRAPHICAL SCOPE 47
2.3 YEARS CONSIDERED FOR THE STUDY 48
2.4 DBMR TRIPOD DATA VALIDATION MODEL 49
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 52
2.6 DBMR MARKET POSITION GRID 53
2.7 VENDOR SHARE ANALYSIS 55
2.8 MULTIVARIATE MODELING 56
2.9 COMPONENT TYPE TIMELINE CURVE 56
2.10 SECONDARY SOURCES 57
2.11 ASSUMPTIONS 57
3 EXECUTIVE SUMMARY 58
4 PREMIUM INSIGHTS 61
5 MARKET OVERVIEW 62
5.1 DRIVERS 64
5.1.1 INCREASING CONSUMPTION OF CONSUMER ELECTRONICS 64
5.1.2 GROWING DEMAND FOR SEMICONDUCTORS ACROSS THE GLOBE 65
5.1.3 EMERGENCE OF A LARGE NUMBER OF SEMICONDUCTOR MANUFACTURING FACILITIES 65
5.1.4 TECHNOLOGICAL ADVANCEMENTS AND THE ADOPTION OF INNOVATIVE TECHNOLOGIES SUCH AS ARTIFICIAL INTELLIGENCE AND BLOCKCHAIN 66
5.1.5 GROWING ADOPTION OF IOT ACROSS THE SEMICONDUCTOR INDUSTRY 67
5.2 RESTRAINTS 68
5.2.1 HIGH COMPETITION IN THE SEMICONDUCTOR MANUFACTURING MARKET 68
5.2.2 HIGH R&D COST IN THE SEMICONDUCTOR EQUIPMENT MARKET 68
5.3 OPPORTUNITIES 69
5.3.1 RISE IN DIGITAL SUPPLY CHAIN ACROSS THE GLOBE 69
5.3.2 INTRODUCTION OF KERFLESS WAFER OVER TRADITIONAL WAFER 69
5.3.3 VERY HIGH GROWTH OF THE AUTOMOBILE INDUSTRY 70
5.4 CHALLENGES 70
5.4.1 DISRUPTION IN THE SUPPLY CHAIN INDUSTRY 70
5.4.2 ENVIRONMENTAL CONCERNS RAISED DUE TO SEMICONDUCTOR PRODUCTION 71
6 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE 72
6.1 OVERVIEW 73
6.2 FRONT END EQUIPMENT 74
6.2.1 LITHOGRAPHY 75
6.2.1.1 DUV 75
6.2.1.2 EUV 75
6.2.2 DEPOSITION 75
6.2.2.1 PVD 76
6.2.2.2 CVD 76
6.2.3 WAFER SURFACE CONDITIONING 76
6.2.3.1 ETCHING 76
6.2.3.2 CHEMICAL 76
6.2.4 CLEANING 77
6.2.4.1 BATCH SPRAY CLEANING SYSTEM 77
6.2.4.2 SINGLE-WAFER SPRAY SYSTEM 77
6.2.4.3 SINGLE-WAFER CRYOGENIC SYSTEM 77
6.2.4.4 BATCH IMMERSION CLEANING SYSTEM 77
6.2.4.5 SCRUBBER 77
6.2.5 OTHER EQUIPMENT 78
6.3 BACK END EQUIPMENT 78
6.3.1 TESTING 78
6.3.2 ASSEMBLY AND PACKING 79
6.3.3 DICING EQUIPMENT 79
6.3.4 BONDING EQUIPMENT 79
6.3.5 METROLOGY 79
7 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSIONS 80
7.1 OVERVIEW 81
7.2 3D 82
7.3 2.5D 83
7.4 2D 83
8 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE 84
8.1 OVERVIEW 85
8.2 MEMORY 86
8.3 MEMS 87
8.4 FOUNDRY 87
8.5 ANALOG 88
8.6 MPU 88
8.7 LOGIC 89
8.8 DISCRETE 89
8.9 OTHERS 90
9 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT 91
9.1 OVERVIEW 92
9.2 INTEGRATED DEVICE MANUFACTURER (IDM) FIRMS 93
9.3 FOUNDRY 94
9.4 OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) COMPANIES 94
10 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY EQUIPMENT 95
10.1 OVERVIEW 96
10.2 FACTORY AUTOMATION 97
10.2.1 FRONT END EQUIPMENT 98
10.2.2 BACK END EQUIPMENT 98
10.3 GAS CONTROL EQUIPMENT 98
10.3.1 FRONT END EQUIPMENT 99
10.3.2 BACK END EQUIPMENT 99
10.4 CHEMICAL CONTROL EQUIPMENT 99
10.4.1 FRONT END EQUIPMENT 99
10.4.2 BACK END EQUIPMENT 100
10.5 OTHERS 100
11 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 101
11.1 NORTH AMERICA 102
11.1.1 U.S. 109
11.1.2 CANADA 113
11.1.3 MEXICO 117
12 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY LANDSCAPE 121
12.1 COMPANY SHARE ANALYSIS: NORTH AMERICA 121
13 SWOT ANALYSIS 122
14 COMPANY PROFILE 123
14.1 ASML 123
14.1.1 COMPANY SNAPSHOT 123
14.1.2 REVENUE ANALYSIS 123
14.1.3 COMPANY SHARE ANALYSIS 124
14.1.4 PRODUCT PORTFOLIO 124
14.1.5 RECENT DEVELOPMENT 124
14.2 TOKYO ELECTRON LIMITED 125
14.2.1 COMPANY SNAPSHOT 125
14.2.2 REVENUE ANALYSIS 125
14.2.3 COMPANY SHARE ANALYSIS 126
14.2.4 PRODUCT PORTFOLIO 126
14.2.5 RECENT DEVELOPMENTS 127
14.3 LAM RESEARCH CORPORATION 128
14.3.1 COMPANY SNAPSHOT 128
14.3.2 REVENUE ANALYSIS 128
14.3.3 COMPANY SHARE ANALYSIS 129
14.3.4 PRODUCT PORTFOLIO 129
14.3.5 RECENT DEVELOPMENT 130
14.4 KLA CORPORATION 131
14.4.1 COMPANY SNAPSHOT 131
14.4.2 REVENUE ANALYSIS 131
14.4.3 COMPANY SHARE ANALYSIS 132
14.4.4 PRODUCT PORTFOLIO 132
14.4.5 RECENT DEVELOPMENT 132
14.5 APPLIED MATERIALS, I.N.C. 133
14.5.1 COMPANY SNAPSHOT 133
14.5.2 REVENUE ANALYSIS 133
14.5.3 COMPANY SHARE ANALYSIS 134
14.5.4 PRODUCT AND TECHNOLOGIES PORTFOLIO 134
14.5.5 RECENT DEVELOPMENTS 136
14.6 ADVANCED DICING TECHNOLOGIES 137
14.6.1 COMPANY SNAPSHOT 137
14.6.2 PRODUCT PORTFOLIO 137
14.6.3 RECENT DEVELOPMENTS 137
14.7 ADVANTEST CORPORATION 138
14.7.1 COMPANY SNAPSHOT 138
14.7.2 REVENUE ANALYSIS 138
14.7.3 PRODUCTS PORTFOLIO 139
14.7.4 RECENT DEVELOPMENTS 140
14.8 ASMPT 141
14.8.1 COMPANY SNAPSHOT 141
14.8.2 REVENUE ANALYSIS 142
14.8.3 PRODUCTS PORTFOLIO 142
14.8.4 RECENT DEVELOPMENTS 143
14.9 CANON MACHINERY INC. 144
14.9.1 COMPANY SNAPSHOT 144
14.9.2 PRODUCT PORTFOLIO 144
14.9.3 RECENT DEVELOPMENT 145
14.10 EV GROUP 146
14.10.1 COMPANY SNAPSHOT 146
14.10.2 PRODUCT PORTFOLIO 146
14.10.3 RECENT DEVELOPMENTS 146
14.11 EVATEC AG 147
14.11.1 COMPANY SNAPSHOT 147
14.11.2 PRODUCT PORTFOLIO 147
14.11.3 RECENT DEVELOPMENT 147
14.12 FORMFACTOR. 148
14.12.1 COMPANY SNAPSHOT 148
14.12.2 REVENUE ANALYSIS 149
14.12.3 PRODUCTS PORTFOLIO 150
14.12.4 RECENT DEVELOPMENTS 150
14.13 GIGAPHOTON INC. 151
14.13.1 COMPANY SNAPSHOT 151
14.13.2 PRODUCTS PORTFOLIO 151
14.13.3 RECENT DEVELOPMENTS 152
14.14 HITACHI HIGH-TECH CORPORATION 153
14.14.1 COMPANY SNAPSHOT 153
14.14.2 PRODUCT PORTFOLIO 153
14.14.3 RECENT DEVELOPMENTS 153
14.15 MODUTEK CORPORATION 154
14.15.1 COMPANY SNAPSHOT 154
14.15.2 PRODUCT PORTFOLIO 154
14.15.3 RECENT DEVELOPMENTS 155
14.16 NOIVION S.R.L. 156
14.16.1 COMPANY SNAPSHOT 156
14.16.2 PRODUCT PORTFOLIO 156
14.16.3 RECENT DEVELOPMENTS 156
14.17 NORDSON CORPORATION 157
14.17.1 COMPANY SNAPSHOT 157
14.17.2 REVENUE ANALYSIS 157
14.17.3 PRODUCT PORTFOLIO 158
14.17.4 RECENT DEVELOPMENTS 158
14.18 ONTO INNOVATION. 159
14.18.1 COMPANY SNAPSHOT 159
14.18.2 REVENUE ANALYSIS 160
14.18.3 PRODUCTS PORTFOLIO 161
14.18.4 RECENT DEVELOPMENTS 161
14.19 PALOMAR TECHNOLOGIES 162
14.19.1 COMPANY SNAPSHOT 162
14.19.2 PRODUCTS PORTFOLIO 162
14.19.3 RECENT DEVELOPMENTS 163
14.20 PLASMA-THERM 164
14.20.1 COMPANY SNAPSHOT 164
14.20.2 PRODUCT PORTFOLIO 164
14.20.3 RECENT DEVELOPMENTS 165
14.21 QP TECHNOLOGIES 166
14.21.1 COMPANY SNAPSHOT 166
14.21.2 SERVICE PORTFOLIO 166
14.21.3 RECENT DEVELOPMENT 167
14.22 SCREEN HOLDINGS CO., LTD. 168
14.22.1 COMPANY SNAPSHOT 168
14.22.2 REVENUE ANALYSIS 169
14.22.3 PRODUCTS PORTFOLIO 170
14.22.4 RECENT DEVELOPMENTS 171
14.23 SUSS MICROTEC SE 172
14.23.1 COMPANY SNAPSHOT 172
14.23.2 REVENUE ANALYSIS 172
14.23.3 PRODUCT PORTFOLIO 173
14.23.4 RECENT DEVELOPMENTS 174
14.24 TERADYNE INC. 175
14.24.1 COMPANY SNAPSHOT 175
14.24.2 REVENUE ANALYSIS 175
14.24.3 PRODUCTS PORTFOLIO 176
14.24.4 RECENT DEVELOPMENTS 177
14.25 TOKYO SEIMITSU CO., LTD 178
14.25.1 COMPANY SNAPSHOT 178
14.25.2 REVENUE ANALYSIS 178
14.25.3 PRODUCTS PORTFOLIO 179
14.25.4 RECENT DEVELOPMENTS 181
14.26 UNITES SYSTEMS A.S. 182
14.26.1 COMPANY SNAPSHOT 182
14.26.2 PRODUCT PORTFOLIO 182
14.26.3 RECENT DEVELOPMENTS 183
14.27 VEECO INSTRUMENTS INC. 184
14.27.1 COMPANY SNAPSHOT 184
14.27.2 REVENUE ANALYSIS 184
14.27.3 PRODUCT PORTFOLIO 185
14.27.4 RECENT DEVELOPMENT 185
15 QUESTIONNAIRE 186
16 RELATED REPORTS 188
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