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Report
Global Flexible Printed Circuit (FPC) Market
Market Report I 2025-11-01 I 350 Pages I Data Bridge Market Research
The global Flexible Printed Circuit (FPC) market is expected to reach USD 58.58 billion by 2032 from USD 23.17 billion in 2024, growing with a CAGR of 12.4% in the forecast period of 2025 to 2032.
Market Segmentation:
Global Flexible Printed Circuit (FPC) Market Segmentation, By Type (Multi-Layer, Double Sided, Single Sided, Rigid Flexible Circuit, Dual Access, Sculptured FPC and Others), Manufacturing Process (Subtractive Process, Additive Process, Adhesive and Adhesiveless Lamination) Material (Base Material and Conductor Material), Flexibility (Static Flex (Flex-To-Install), Dynamic Flex (Flex-To-Fit/Move), and Rollable / Foldable), Form Factor (Standard Thickness, Ultra-Thin (<50 M), Thick (>200 M)), End-User (Consumer Electronics, Automotive, Industrial & Robotics, IoT & Smart Devices, Medical Devices, Telecommunication, Aerospace & Defense, Others), Distribution Channel (Direct Sales and In-Direct Sales), Countries (Germany, France, United Kingdom, Italy, Sweden, Netherlands, Switzerland, Spain, Finland, Norway, Denmark, Turkey, Belgium, Russia, Rest of Europe, U.S., Canada, Mexico, Brazil, Argentina, Colombia, Chile, Peru, Venezuela, Ecuador, Uruguay, Paraguay, Bolivia, Rest of South America, China, Japan, South Korea, Taiwan, India, Vietnam, Singapore, Malaysia, Thailand, Philippines, Indonesia, Australia, New Zealand, Rest of Asia-Pacific, U.A.E., Saudi Arabia, Israel, South Africa, Egypt, Qatar, Kuwait, Oman, Bahrain, Rest of Middle East and Africa) - Industry Trends and Forecast to 2032
Overview of Global Flexible Printed Circuit (FPC) Market Dynamics:
Drivers
- Expanding FPC adoption in automotive and medical electronics
- Rising demand for compact and lightweight electronic devices
- Technological advancements in FPC design and materials
- Growing demand for flexible circuits in electric and hybrid vehicles
Restraints
- Dependence of FPC manufacturing on costly polyimide and copper materials
- High defect rates during precision bending operations
Opportunitites
- Increasing adoption of FPC circuit in aerospace and defense systems
- Expanding FPC applications in next-generation foldable phones
- Strategic partnerships for advanced rigid-flex product development
Market Players:
The key players operating in the global Flexible Printed Circuit (FPC) market are:
- NOK CORPORATION (Japan)
- Zhen Ding Tech. Group Technology Holding Limited (Taiwan)
- Nitto Denko Corporation (Japan)
- Fujikura Printed Circuits Ltd. (Subsidiary of Fujikura Ltd.) (Japan)
- Sumitomo Electric Industries, Ltd. (Japan)
- Flexium Interconnect Inc. (Taiwan)
- Amphenol Corporation (United States)
- MFLEX (United States)
- IBIDEN (Japan)
- Wurth Elektronik eiSos GmbH & Co. KG (Germany)
- Interflex Co., Ltd. (South Korea)
- TTM Technologies Inc. (United States)
- Cicor Group (Switzerland)
- MFS Technology (Singapore)
- Cirexx International (United States)
- AS&R Circuits India Pvt. Ltd. (India)
- PCB Power (India)
- AdvancedPCB (China)
- QDOS (United Kingdom)
- MEKTEC Manufacturing Co. (Thailand)
- FPCWAY (China)
- Tate Circuit Industries Ltd (United Kingdom)
- Flexible Circuit (United States)
- Millennium Circuits Limited (United States)
- Shah Circuitech (India)
TABLE OF CONTENTS
1 INTRODUCTION 86
1.1 OBJECTIVES OF THE STUDY 86
1.2 MARKET DEFINITION 86
1.3 OVERVIEW OF GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 86
1.4 LIMITATIONS 88
1.5 MARKETS COVERED 89
2 MARKET SEGMENTATION 94
2.1 MARKETS COVERED 94
2.2 GEOGRAPHICAL SCOPE 95
2.3 YEARS CONSIDERED FOR THE STUDY 96
2.4 CURRENCY AND PRICING 96
2.5 DBMR TRIPOD DATA VALIDATION MODEL 97
2.6 MULTIVARIATE MODELLING 100
2.7 TYPE LIFELINE CURVE 100
2.8 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 101
2.9 DBMR MARKET POSITION GRID 102
2.10 SECONDARY SOURCES 104
2.11 ASSUMPTIONS 104
3 EXECUTIVE SUMMARY 105
4 PREMIUM INSIGHTS 113
4.1 PORTER'S FIVE FORCES ANALYSIS: GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 115
4.1.1 INTRODUCTION: 115
4.1.2 INTENSITY OF COMPETITIVE RIVALRY (MODERATE TO HIGH) 116
4.1.3 THREAT OF NEW ENTRANTS (LOW TO MODERATE) 116
4.1.4 THREAT OF SUBSTITUTES (LOW) 117
4.1.5 BARGAINING POWER OF SUPPLIERS (MODERATE) 117
4.1.6 BARGAINING POWER OF BUYERS (HIGH) 117
4.1.7 CONCLUSION 118
4.2 VALUE CHAIN ANALYSIS - GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 119
4.2.1 INTRODUCTION 119
4.2.2 RAW MATERIAL AND COMPONENT SUPPLY 119
4.2.3 MATERIAL INPUTS 120
4.2.4 SUPPLIER ROLES AND COLLABORATION 120
4.2.5 CHALLENGES AND RISKS 120
4.2.6 MANUFACTURING AND ASSEMBLY 121
4.2.7 DISTRIBUTION AND LOGISTICS 122
4.2.8 INTEGRATION AND SYSTEM ASSEMBLY 123
4.2.9 END-USE APPLICATIONS AND AFTERMARKET 124
4.2.10 CROSS-STAGE STRATEGIC CONSIDERATIONS 125
4.3 REGULATORY STANDARDS GOVERNING THE GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 126
4.3.1 MATERIAL AND DESIGN STANDARDS 126
4.3.2 ELECTRICAL AND MECHANICAL RELIABILITY TESTING 126
4.3.3 ENVIRONMENTAL AND SUSTAINABILITY COMPLIANCE 126
4.3.4 QUALITY MANAGEMENT AND MANUFACTURING PROCESS STANDARDS 127
4.3.5 SECTOR-SPECIFIC REGULATORY FRAMEWORKS 127
4.3.6 EMERGING STANDARDS AND INDUSTRY ADAPTATION 127
4.3.7 CONCLUSION 127
4.4 PENETRATION AND GROWTH PROSPECT MAPPING - GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 128
4.4.1 INTRODUCTION 128
4.4.2 FRAMEWORK AND METHODOLOGY (SUMMARY) 128
4.4.3 CURRENT PENETRATION ANALYSIS 128
4.4.3.1 GEOGRAPHIC PENETRATION 128
4.4.3.2 VERTICAL / APPLICATION PENETRATION 128
4.4.3.3 TECHNOLOGY & PRODUCT PENETRATION 129
4.4.4 GROWTH-PROSPECT MAPPING: DRIVERS AND ENABLERS 129
4.4.4.1 TECHNOLOGY AND PRODUCT DRIVERS 129
4.4.4.2 COMMERCIAL AND SUPPLY-CHAIN ENABLERS 129
4.4.4.3 POLICY & ECOSYSTEM ENABLERS 129
4.4.5 GROWTH LIMITATIONS AND CONSTRAINTS 130
4.4.5.1 TECHNICAL CONSTRAINTS 130
4.4.5.2 SUPPLY AND COST CONSTRAINTS 130
4.4.5.3 MARKET & COMMERCIAL CONSTRAINTS 130
4.4.6 MAPPING GROWTH PROSPECTS BY SCENARIO 130
4.4.7 STRATEGIC IMPLICATIONS AND PRIORITIZED ACTIONS 131
4.4.7.1 FOR FABRICATORS AND EQUIPMENT SUPPLIERS 131
4.4.7.2 FOR OEMS AND INTEGRATORS 131
4.4.7.3 FOR INVESTORS AND POLICYMAKERS 131
4.4.8 MEASURABLE KPIS FOR TRACKING PENETRATION AND GROWTH 131
4.5 NEW BUSINESS & EMERGING REVENUE OPPORTUNITIES - FUTURE OUTLOOK GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 132
4.5.1 INTRODUCTION 132
4.5.2 DEMAND PULL: APPLICATION-LED REVENUE POOLS 132
4.5.2.1 AUTOMOTIVE & EV ARCHITECTURES 132
4.5.2.2 WEARABLES, TEXTILE ELECTRONICS & CONSUMER IOT 132
4.5.2.3 MEDICAL & BIO-INTEGRATED DEVICES 132
4.5.2.4 AEROSPACE, SPACE & INDUSTRIAL ROBOTICS 132
4.5.3 ECHNOLOGY-DRIVEN BUSINESS MODELS & SERVICES 133
4.5.3.1 DESIGN-AS-A-SERVICE AND RAPID PROTOTYPING 133
4.5.3.2 MANUFACTURING-AS-A-SERVICE (MAAS) / FLEXIBLE CAPACITY LEASING 133
4.5.3.3 ADDITIVE & PRINTED ELECTRONICS LICENSING 133
4.5.3.4 SYSTEM INTEGRATION & MODULE SUPPLY 133
4.5.3.5 SUBSCRIPTION & DATA-DRIVEN SERVICES 133
4.5.4 MANUFACTURING & PROCESS INNOVATION - REVENUE LEVERS 133
4.5.4.1 ROLL-TO-ROLL AND HIGH-THROUGHPUT FABRICATION 133
4.5.4.2 ADVANCED SUBSTRATES & HIGH-RELIABILITY MATERIALS 133
4.5.4.3 HYBRID PRODUCTION (ADDITIVE + SUBTRACTIVE) 133
4.5.4.4 IN-PROCESS INSPECTION & DIGITAL TRACEABILITY 134
4.5.5 SUPPLY-CHAIN & LOCALIZATION OPPORTUNITIES 134
4.5.5.1 ON-SHORING AND REGIONAL HUBS 134
4.5.5.2 TIERED SUPPLIER ECOSYSTEMS 134
4.5.5.3 LOGISTICS AND VALUE-ADDED DISTRIBUTION 134
4.5.6 AFTERMARKET, RECYCLING & CIRCULAR ECONOMY REVENUE STREAMS 134
4.5.6.1 COMPONENT RECOVERY & MATERIAL REUSE 134
4.5.6.2 SERVICE & REPAIR PROGRAMS 134
4.5.7 BARRIERS, RISKS & MITIGATIONS (BUSINESS-LEVEL CONSIDERATIONS) 134
4.5.8 STRATEGIC RECOMMENDATIONS FOR NEW & EMERGING BUSINESSES 135
4.5.9 FUTURE OUTLOOK (5-10 YEAR HORIZON) 135
4.5.10 CONCLUSION 135
4.6 TECHNOLOGY MATRIX ANALYSIS-GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 136
4.7 COMPANY COMPARATIVE ANALYSIS - GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 140
4.8 COMPANY SERVICE PLATFORM MATRIX - GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET 143
4.9 EMERGING PRODUCTION PROCESSES SHAPING THE FPC AND FHE INDUSTRIES 145
4.10 KEY INSIGHTS ON TECHNOLOGICAL ADVANCEMENTS 148
4.10.1 KEY TECHNOLOGICAL BREAKTHROUGHS IN FPC MANUFACTURING 148
4.10.1.1 ADHESIVELESS LAMINATION TECHNOLOGY 148
4.10.1.2 SEMI-ADDITIVE PROCESS (SAP) & MODIFIED SAP (MSAP) 148
4.10.1.3 LASER DIRECT IMAGING (LDI) & UV LASER MICROVIA DRILLING 149
4.10.2 MARKET IMPACT & STRATEGIC IMPLICATIONS 150
4.10.3 MATERIAL INNOVATION IN COPPER FOILS & POLYIMIDE FILMS - STRATEGIC DRIVER FOR FPC MARKET LEADERSHIP 151
4.10.4 SUPPLY CHAIN & STRATEGIC IMPLICATIONS OF FPC MATERIAL ADVANCEMENTS 153
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5 MARKET OVERVIEW 155
5.1 DRIVER 157
5.1.1 EXPANDING FPC ADOPTION IN AUTOMOTIVE AND MEDICAL ELECTRONICS. 157
5.1.2 RISING DEMAND FOR COMPACT AND LIGHTWEIGHT ELECTRONIC DEVICES 158
5.1.3 TECHNOLOGICAL ADVANCEMENTS IN FPC DESIGN AND MATERIALS 159
5.1.4 GROWING DEMAND FOR FLEXIBLE CIRCUITS IN ELECTRIC AND HYBRID VEHICLES 160
5.2 RESTRAINTS 161
5.2.1 DEPENDENCE OF FPC MANUFACTURING ON COSTLY POLYIMIDE AND COPPER MATERIALS 161
5.2.2 HIGH DEFECT RATES DURING PRECISION BENDING OPERATIONS 162
5.3 OPPORTUNITIES 163
5.3.1 INCREASING ADOPTION OF FPC CIRCUIT IN AEROSPACE AND DEFENSE SYSTEMS. 163
5.3.2 EXPANDING FPC APPLICATIONS IN NEXT-GENERATION FOLDABLE PHONES 164
5.3.3 STRATEGIC PARTNERSHIPS FOR ADVANCED RIGID-FLEX PRODUCT DEVELOPMENT 165
5.4 CHALLENGES 166
5.4.1 CONTINUOUS PRESSURE TO REDUCE COSTS WHILE SUSTAINING QUALITY STANDARDS 166
5.4.2 RAPID TECHNOLOGICAL CHANGES DEMANDING CONTINUOUS INNOVATION INVESTMENT 167
6 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY TYPE 168
6.1 OVERVIEW 169
6.2 MULTI-LAYER 170
6.3 DOUBLE SIDED 171
6.4 SINGLE SIDED 172
6.5 RIGID FLEXIBLE CIRCUIT 173
6.6 DUAL ACCESS 174
6.7 SCULPTURED FPC 175
6.8 OTHERS 176
7 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY MANUFACTURING PROCESS 177
7.1 OVERVIEW 178
7.2 SUBTRACTIVE PROCESS 180
7.3 ADDITIVE PROCESS 181
7.4 ADHESIVE AND ADHESIVELESS LAMINATION 182
8 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY MATERIAL 183
8.1 OVERVIEW 184
8.2 BASE MATERIAL 185
8.3 CONDUCTOR MATERIAL 187
9 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY FLEXIBILITY 188
9.1 OVERVIEW 189
9.2 STATIC FLEX (FLEX-TO-INSTALL) 190
9.3 DYNAMIC FLEX (FLEX-TO-FIT/MOVE) 191
9.4 ROLLABLE / FOLDABLE 192
10 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY FORM FACTOR 193
10.1 OVERVIEW 194
10.2 STANDARD THICKNESS 195
10.3 ULTRA-THIN (<50 M) 196
10.4 THICK (>200 M) 197
11 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY END-USER 198
11.1 OVERVIEW 199
11.2 CONSUMER ELECTRONICS 200
11.3 AUTOMOTIVE 203
11.4 INDUSTRIAL & ROBOTICS 206
11.5 IOT & SMART DEVICES 209
11.6 MEDICAL DEVICES 212
11.7 TELECOMMUNICATION 215
11.8 AEROSPACE & DEFENSE 217
11.9 OTHERS 219
12 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY DISTRIBUTION CHANNEL 220
12.1 OVERVIEW 221
12.2 DIRECT SALES 222
12.3 IN-DIRECT SALES 222
13 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, BY REGION 224
13.1 OVERVIEW 225
13.2 ASIA-PACIFIC 229
13.2.1 CHINA 242
13.2.2 JAPAN 253
13.2.3 SOUTH KOREA 263
13.2.4 TAIWAN 274
13.2.5 INDIA 284
13.2.6 VIETNAM 293
13.2.7 SINGAPORE 302
13.2.8 MALAYSIA 311
13.2.9 THAILAND 320
13.2.10 PHILIPPINES 329
13.2.11 INDONESIA 338
13.2.12 AUSTRALIA 347
13.2.13 NEW ZEALAND 356
13.2.14 REST OF ASIA-PACIFIC 365
13.3 NORTH AMERICA 366
13.3.1 U.S. 377
13.3.2 CANADA 388
13.3.3 MEXICO 398
13.4 EUROPE 407
13.4.1 GERMANY 419
13.4.2 FRANCE 428
13.4.3 UNITED KINGDOM 437
13.4.4 ITALY 446
13.4.5 SWEDEN 455
13.4.6 NETHERLANDS 464
13.4.7 SWITZERLAND 473
13.4.8 SPAIN 482
13.4.9 FINLAND 491
13.4.10 NORWAY 500
13.4.11 DENMARK 509
13.4.12 TURKEY 518
13.4.13 BELGIUM 527
13.4.14 RUSSIA 535
13.4.15 REST OF EUROPE 544
13.5 SOUTH AMERICA 545
13.5.1 BRAZIL 556
13.5.2 ARGENTINA 565
13.5.3 COLOMBIA 574
13.5.4 CHILE 583
13.5.5 PERU 592
13.5.6 VENEZUELA 601
13.5.7 ECUADOR 610
13.5.8 URUGUAY 619
13.5.9 PARAGUAY 628
13.5.10 BOLIVIA 637
13.5.11 REST OF SOUTH AMERICA 645
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13.6 MIDDLE EAST AND AFRICA 646
13.6.1 U.A.E. 657
13.6.2 SAUDI ARABIA 666
13.6.3 ISRAEL 675
13.6.4 SOUTH AFRICA 684
13.6.5 EGYPT 693
13.6.6 QATAR 702
13.6.7 KUWAIT 711
13.6.8 OMAN 720
13.6.9 BAHRAIN 728
13.6.10 REST OF MIDDLE EAST AND AFRICA 737
14 GLOBAL FLEXIBLE PRINTED CIRCUIT (FPC) MARKET, COMPANY LANDSCAPE 738
14.1 COMPANY SHARE ANALYSIS: GLOBAL 738
14.2 COMPANY SHARE ANALYSIS: NORTH AMERICA 739
14.3 COMPANY SHARE ANALYSIS: EUROPE 740
14.4 COMPANY SHARE ANALYSIS: ASIA-PACIFIC 741
15 SWOT ANALYSIS 742
16 COMPANY PROFILES 743
16.1 NOK CORPORATION 743
16.1.1 COMPANY SNAPSHOT 743
16.1.2 REVENUE ANALYSIS 744
16.1.3 COMPANY SHARE ANALYSIS 744
16.1.4 PRODUCT PORTFOLIO 745
16.1.5 RECENT DEVELOPMENT 746
16.2 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED 747
16.2.1 COMPANY SNAPSHOT 747
16.2.2 REVENUE ANALYSIS 748
16.2.3 COMPANY SHARE ANALYSIS 748
16.2.4 PRODUCT PORTFOLIO 748
16.2.5 RECENT DEVELOPMENT 749
16.3 NITTO DENKO CORPORATION 750
16.3.1 COMPANY SNAPSHOT 750
16.3.2 REVENUE ANALYSIS 750
16.3.3 COMPANY SHARE ANALYSIS 751
16.3.4 PRODUCT PORTFOLIO 751
16.3.5 RECENT DEVELOPMENT 752
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16.4 FUJIKURA PRINTED CIRCUITS LTD. (SUBSIDIARY OF FUJIKURA LTD.) 753
16.4.1 COMPANY SNAPSHOT 753
16.4.2 REVENUE ANALYSIS 754
16.4.3 COMPANY SHARE ANALYSIS 754
16.4.4 PRODUCT PORTFOLIO 754
16.4.5 RECENT DEVELOPMENT 755
16.5 SUMITOMO ELECTRIC INDUSTRIES, LTD. 756
16.5.1 COMPANY SNAPSHOT 756
16.5.2 REVENUE ANALYSIS 756
16.5.3 COMPANY SHARE ANALYSIS 757
16.5.4 PRODUCT PORTFOLIO 757
16.5.5 RECENT DEVELOPMENT 759
16.6 ADVANCED PCB 760
16.6.1 COMPANY SNAPSHOT 760
16.6.2 PRODUCT PORTFOLIO 760
16.6.3 RECENT DEVELOPMENT 761
16.7 AMPHENOL CORPORATION.. 762
16.7.1 COMPANY SNAPSHOT 762
16.7.2 REVENUE ANALYSIS 762
16.7.3 PRODUCT PORTFOLIO 763
16.7.4 RECENT DEVELOPMENT 763
16.8 AS&R CIRCUITS INDIA PVT. LTD. 764
16.8.1 COMPANY SNAPSHOT 764
16.8.2 PRODUCT PORTFOLIO 764
16.8.3 RECENT DEVELOPMENT 765
16.9 CIREXX INTERNATIONAL 766
16.9.1 COMPANY SNAPSHOT 766
16.9.2 PRODUCT PORTFOLIO 766
16.9.3 RECENT DEVELOPMENT 766
16.10 CICOR GROUP 767
16.10.1 COMPANY SNAPSHOT 767
16.10.2 REVENUE ANALYSIS 767
16.10.3 PRODUCT PORTFOLIO 768
16.10.4 RECENT DEVELOPMENT 769
16.11 FLEXIBLE CIRCUIT 770
16.11.1 COMPANY SNAPSHOT 770
16.11.2 PRODUCT PORTFOLIO 770
16.11.3 RECENT DEVELOPMENT 771
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16.12 FPCWAY 772
16.12.1 COMPANY SNAPSHOT 772
16.12.2 PRODUCT PORTFOLIO 772
16.12.3 RECENT DEVELOPMENT 773
16.13 FLEXIUM INTERCONNECT.INC 774
16.13.1 COMPANY SNAPSHOT 774
16.13.2 REVENUE ANALYSIS 774
16.13.3 PRODUCT PORTFOLIO 775
16.13.4 RECENT DEVELOPMENT 775
16.14 INTERFLEX CO.,LTD. 776
16.14.1 COMPANY SNAPSHOT 776
16.14.2 REVENUE ANALYSIS 776
16.14.3 PRODUCT PORTFOLIO 777
16.14.4 RECENT DEVELOPMENT 777
16.15 IBIDEN 778
16.15.1 COMPANY SNAPSHOT 778
16.15.2 REVENUE ANALYSIS 778
16.15.3 PRODUCT PORTFOLIO 779
16.15.4 RECENT DEVELOPMENT 779
16.16 MILLENNIUM CIRCUITS LIMITED 780
16.16.1 COMPANY SNAPSHOT 780
16.16.2 PRODUCT PORTFOLIO 780
16.16.3 RECENT DEVELOPMENT 780
16.17 MFS TECHNOLOGY 781
16.17.1 COMPANY SNAPSHOT 781
16.17.2 PRODUCT PORTFOLIO 781
16.17.3 RECENT DEVELOPMENT 782
16.18 MEKTEC MANUFACTURING CO. 783
16.18.1 COMPANY SNAPSHOT 783
16.18.2 PRODUCT PORTFOLIO 783
16.18.3 RECENT DEVELOPMENT 784
16.19 MFLEX 785
16.19.1 COMPANY SNAPSHOT 785
16.19.2 PRODUCT PORTFOLIO 785
16.19.3 RECENT DEVELOPMENT 785
16.20 PCB POWER 786
16.20.1 COMPANY SNAPSHOT 786
16.20.2 PRODUCT PORTFOLIO 786
16.20.3 RECENT DEVELOPMENT 787
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16.21 QDOS 788
16.21.1 COMPANY SNAPSHOT 788
16.21.2 PRODUCT PORTFOLIO 788
16.21.3 RECENT DEVELOPMENT 789
16.22 SHAH CRICUITECH 790
16.22.1 COMPANY SNAPSHOT 790
16.22.2 PRODUCT PORTFOLIO 790
16.22.3 RECENT DEVELOPMENT 790
16.23 TATE CIRCUIT INDUSTRIES LTD 791
16.23.1 COMPANY SNAPSHOT 791
16.23.2 PRODUCT PORTFOLIO 791
16.23.3 RECENT DEVELOPMENT 792
16.24 TTM TECHNOLOGIES INC 793
16.24.1 COMPANY SNAPSHOT 793
16.24.2 REVENUE ANALYSIS 793
16.24.3 PRODUCT PORTFOLIO 794
16.24.4 RECENT DEVELOPMENT 795
16.25 WURTH ELEKTRONIK EISOS GMBH & CO. KG 796
16.25.1 COMPANY SNAPSHOT 796
16.25.2 PRODUCT PORTFOLIO 796
16.25.3 RECENT DEVELOPMENTS 797
17 QUESTIONNAIRE 798
18 RELATED REPORTS 802
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As most Market Reports are delivered in PDF format we almost never have to add additional Shipping Charges. If, however you are ordering a Higher License service or a specific delivery format (e.g. CD version) charges may apply.
If you are concerned about additional Shipping Charges we recommend you to Contact us to double check.
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- Prices
- Ordering
- By Credit Card
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We work in Partnership with PayU to ensure payments are made securely in a fast and effortless way. PayU is the e-payments division of Naspers.
Naspers operates in over 133 International Markets and ranks 3rd Globally in terms of the number of e-commerce customers served.
For more information on PayU please visit: https://www.payu.pl/en/about-us
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- By Money Transfer
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If you require an invoice prior to payment, this is possible. To ensure a speedy delivery of the Market Report we require all relevant company details and you agree to maximum payment terms of 30 days from receipt of order.
With our regular clients deliver of the Market Report can be made prior to receiving payment, however in some circumstances we may ask for payment to be received before arranging for the Market Report to be delivered.
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- By Credit Card
- Security
- Website security
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We have specifically partnered with leading International companies to protect your privacy by using different technologies and processes to ensure security.
Everything submitted to Scotts International is encrypted via SSL (Secure Socket Layer) and all personal information provided to Scotts International is stored on computer systems with limited access in controlled environments.
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- Credit Card Security
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We partner with PayU (https://www.payu.pl/en/about-us) to ensure all credit card payments are made securely in a fast and effortless way.
PayU offers 250+ various payment channels and eWallet services across 4 continents allowing buyers to pay electronically, whether on a computer or a mobile device.
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- Website security