Report

TABLE OF CONTENTS
1 INTRODUCTION 21
1.1 OBJECTIVES OF THE STUDY 21
1.2 MARKET DEFINITION 21
1.3 OVERVIEW OF THE EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC)MARKET 21
1.4 CURRENCY AND PRICING 23
1.5 LIMITATIONS 23
1.6 MARKETS COVERED 23
2 MARKET SEGMENTATION 26
2.1 MARKETS COVERED 26
2.2 GEOGRAPHICAL SCOPE 27
2.3 YEARS CONSIDERED FOR THE STUDY 27
2.4 DBMR TRIPOD DATA VALIDATION MODEL 28
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 31
2.6 DBMR MARKET POSITION GRID 32
2.7 VENDOR SHARE ANALYSIS 34
2.8 MULTIVARIATE MODELING 35
2.9 DESIGN TYPE TIMELINE CURVE 36
2.10 MARKET APPLICATION COVERAGE GRID 37
2.11 SECONDARY SOURCES 38
2.12 ASSUMPTIONS 38
3 EXECUTIVE SUMMARY 39
4 PREMIUM INSIGHTS 41
4.1 PORTER'S FIVE FORCES ANALYSIS 42
4.2 SUPPLY CHAIN ANALYSIS 43
4.3 TECHNOLOGICAL ANALYSIS 44
4.3.1 AI 44
4.3.2 INTERNET OF THINGS (IOT) 45
4.3.3 VLSI TECHNOLOGY 45
4.3.4 NANOTECHNOLOGY 45
4.4 CRITICALITIES IN THE MARKET 46
4.4.1 DEBUGGING ISSUES WITH DESIGN 46
4.4.2 SYSTEM INTEGRATION ISSUES 46
4.5 CASE STUDY 47
4.5.1 ARQUIMEA GROUP, S.A. 47
4.5.2 IC'ALPS SAS 47
4.6 REGULATORY FRAMEWORK 48
5 MARKET OVERVIEW 49
5.1 DRIVERS 51
5.1.1 RISE IN USAGE OF ELECTRONIC WARFARE SOLUTIONS 51
5.1.2 INCREASE IN THE ADOPTION OF AUTONOMOUS WEAPON SYSTEM 51
5.1.3 RISE IN THE USAGE OF IOT DEVICES 52
5.1.4 RISE IN DEMAND FOR MINIATURIZED ELECTRONIC DEVICE 53
5.2 RESTRAINTS 54
5.2.1 HIGH COST ASSOCIATED WITH MANUFACTURING CUSTOMIZED CIRCUITS 54
5.2.2 ASICS VULNERABILITY TOWARDS SECURITY ATTACKS/CYBER ATTACKS 55
5.3 OPPORTUNITIES 55
5.3.1 UTILIZING ASIC TECHNOLOGIES FOR POWERING AI 55
5.3.2 UPSURGE IN THE ADOPTION OF MECHATRONICS FOR VARIOUS APPLICATIONS 56
5.3.3 RISE IN THE DEPLOYMENT OF DATA CENTERS AND HIGH-PERFORMANCE COMPUTING 57
5.4 CHALLENGES 58
5.4.1 FUNCTIONAL RELIABILITY ISSUES FACED IN ASIC 58
5.4.2 COMPLEXITY INVOLVED IN DESIGNING AND FABRICATION OF APPLICATION-SPECIFIC CIRCUITS 58
6 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY DESIGN TYPE 60
6.1 OVERVIEW 61
6.2 SEMI-CUSTOM ASIC 62
6.2.1 STANDARD -CELL-BASED 62
6.2.2 GATE-ARRAY-BASED 62
6.2.2.1 CHANNEL LESS GATE ARRAYS 62
6.2.2.2 STRUCTURED GATE ARRAYS 62
6.2.2.3 CHANNELED GATE ARRAYS 63
6.3 PROGRAMMABLE ASIC 63
6.3.1 FPGAS (FIELD PROGRAMMABLE GATE ARRAY) SECURITY 63
6.3.1.1 BY TYPE 63
6.3.1.1.1 HIGH-END FPGAS 64
6.3.1.1.2 LOW-END FPGAS 64
6.3.1.1.3 MID-RANGE FPGAS 64
6.3.1.2 BY NODE 64
6.3.1.2.1 LESS THAN 28 NM 64
6.3.1.2.2 28-90 NM 64
6.3.1.2.3 MORE THAN 90 NM 64
6.3.1.3 BY SECURITY 65
6.3.1.3.1 DEFENSE GRADE SECURITY 65
6.3.1.3.1.1 DESIGN SECURITY 65
6.3.1.3.1.2 DATA SECURITY 65
6.3.1.3.1.3 SECURE HARDWARE 65
6.3.1.3.1.4 OTHERS 66
6.3.1.3.2 PHYSICAL MEMORY PROTECTION (PMP) 66
6.3.1.4 BY MEMORY 66
6.3.1.4.1 BLOCK MEMORY 66
6.3.1.4.2 DISTRIBUTED MEMORY 66
6.3.1.5 BY FUNCTIONAL BLOCK 66
6.3.1.5.1 LOGIC BLOCKS 67
6.3.1.5.1.1 COMBINATIONAL GATES 67
6.3.1.5.1.2 MULTIPLEXES 67
6.3.1.5.1.3 TRANSISTOR PAIRS 67
6.3.1.5.1.4 OTHERS 68
6.3.1.5.2 ROUTING 68
6.3.2 PROGRAMMABLE LOGIC DEVICES (PLDS) 68
6.3.2.1 SIMPLE PROGRAMMABLE LOGIC DEVICE (SPLDS) 68
6.3.2.2 HIGH CAPACITY PROGRAMMABLE LOGIC DEVICE (HCPLDS) 68
6.4 FULL CUSTOM ASIC 68
7 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY TECHNOLOGY 69
7.1 OVERVIEW 70
7.2 SRAM 71
7.3 ANTIFUSE 71
7.4 FLASH BASED/EEPROM 71
7.5 EPROM 71
7.6 OTHERS 71
8 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY FUNCTIONALITY 72
8.1 OVERVIEW 73
8.2 REAL-TIME 74
8.3 STANDALONE 74
9 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY APPLICATION 75
9.1 OVERVIEW 76
9.2 DEFENSE EQUIPMENT 77
9.3 AIRCRAFT 77
9.4 WEAPONS 77
9.5 SPACECRAFT 77
9.6 SHIPS 77
9.7 OTHERS 77
10 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY COUNTRY 78
10.1 GERMANY 83
10.2 FRANCE 87
10.3 NETHERLANDS 91
10.4 ITALY 95
10.5 SPAIN 99
10.6 POLAND 103
10.7 SWEDEN 107
10.8 BELGIUM 111
10.9 AUSTRIA 115
10.10 DENMARK 119
10.11 REST OF EUROPEAN UNION 123
11 EUROPEAN UNION APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET: COMPANY LANDSCAPE 124
11.1 COMPANY SHARE ANALYSIS: EUROPEAN UNION 124
12 SWOT ANALYSIS 125
13 COMPANY PROFILE 126
13.1 INFINEON TECHNOLOGIES AG 126
13.1.1 COMPANY SNAPSHOT 126
13.1.2 REVENUE ANALYSIS 127
13.1.3 PRODUCTS PORTFOLIO 128
13.1.4 RECENT DEVELOPMENTS 129
13.2 MICROCHIP TECHNOLOGY INC. (2021) 130
13.2.1 COMPANY SNAPSHOT 130
13.2.2 REVENUE ANALYSIS 130
13.2.3 PRODUCT PORTFOLIO 131
13.2.4 RECENT DEVELOPMENTS 131
13.3 ADVANCED MICRO DEVICES, INC. 133
13.3.1 COMPANY SNAPSHOT 133
13.3.2 REVENUE ANALYSIS 133
13.3.3 PRODUCTS PORTFOLIO 134
13.3.4 RECENT DEVELOPMENTS 135
13.4 HONEYWELL INTERNATIONAL INC. 136
13.4.1 COMPANY SNAPSHOT 136
13.4.2 REVENUE ANALYSIS 136
13.4.3 PRODUCT PORTFOLIO 137
13.4.4 RECENT DEVELOPMENT 137
13.5 TTTECH COMPUTERTECHNIK AG 138
13.5.1 COMPANY SNAPSHOT 138
13.5.2 SOLUTION PORTFOLIO 138
13.5.3 RECENT DEVELOPMENTS 139
13.6 ACHRONIX SEMICONDUCTOR CORPORATION 140
13.6.1 COMPANY SNAPSHOT 140
13.6.2 PRODUCT PORTFOLIO 140
13.6.3 RECENT DEVELOPMENTS 141
13.7 ARQUIMEA 142
13.7.1 COMPANY SNAPSHOT 142
13.7.2 PRODUCT PORTFOLIO 142
13.7.3 RECENT DEVELOPMENT 142
13.8 COBHAM ADVANCED ELECTRONIC SOLUTIONS 143
13.8.1 COMPANY SNAPSHOT 143
13.8.2 PRODUCT PORTFOLIO 143
13.8.3 RECENT DEVELOPMENTS 144
13.9 ENSILICA 145
13.9.1 COMPANY SNAPSHOT 145
13.9.2 PRODUCTS PORTFOLIO 145
13.9.3 RECENT DEVELOPMENTS 146
13.10 IC'ALPS SAS 147
13.10.1 COMPANY SNAPSHOT 147
13.10.2 SERVICE PORTFOLIO 147
13.10.3 RECENT DEVELOPMENT 147
13.11 INTEL CORPORATION 148
13.11.1 COMPANY SNAPSHOT 148
13.11.2 REVENUE ANALYSIS 148
13.11.3 SOLUTION PORTFOLIO 149
13.11.4 RECENT DEVELOPMENTS 149
13.12 LATTICE SEMICONDUCTOR 150
13.12.1 COMPANY SNAPSHOT 150
13.12.2 REVENUE ANALYSIS 150
13.12.3 SOLUTION PORTFOLIO 151
13.12.4 RECENT DEVELOPMENTS 151
13.13 MARVELL 152
13.13.1 COMPANY SNAPSHOT 152
13.13.2 REVENUE ANALYSIS 152
13.13.3 SOLUTION PORTFOLIO 153
13.13.4 RECENT DEVELOPMENT 153
13.14 NANOXPLORE 154
13.14.1 COMPANY SNAPSHOT 154
13.14.2 PRODUCT PORTFOLIO 154
13.14.3 RECENT DEVELOPMENT 154
13.15 QUICKLOGIC CORPORATION 155
13.15.1 COMPANY SNAPSHOT 155
13.15.2 REVENUE ANALYSIS 155
13.15.3 PRODUCT PORTFOLIO 156
13.15.4 RECENT DEVELOPMENTS 156
13.16 RENESAS ELECTRONICS CORPORATION 158
13.16.1 COMPANY SNAPSHOT 158
13.16.2 REVENUE ANALYSIS 158
13.16.3 PRODUCT PORTFOLIO 159
13.16.4 RECENT DEVELOPMENTS 159
13.17 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 161
13.17.1 COMPANY SNAPSHOT 161
13.17.2 REVENUE ANALYSIS 161
13.17.3 PRODUCT PORTFOLIO 162
13.17.4 RECENT DEVELOPMENT 162
13.18 STMICROELECTRONICS 163
13.18.1 COMPANY SNAPSHOT 163
13.18.2 REVENUE ANALYSIS 163
13.18.3 PRODUCT PORTFOLIO 164
13.18.4 RECENT DEVELOPMENT 164
13.19 TEXAS INSTRUMENTS INCORPORATED (2022) 165
13.19.1 COMPANY SNAPSHOT 165
13.19.2 REVENUE ANALYSIS 166
13.19.3 PRODUCT PORTFOLIO 167
13.19.4 RECENT DEVELOPMENTS 168
13.20 TEKMOS INC. 169
13.20.1 COMPANY SNAPSHOT 169
13.20.2 PRODUCT PORTFOLIO 169
13.20.3 RECENT DEVELOPMENT 170
14 QUESTIONNAIRE 171
15 RELATED REPORTS 175