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Report

Europe Semiconductor Manufacturing Equipment Market - Industry Trends and Forecast to 2030

Market Report I 2022-11-01 I 219 Pages I Data Bridge Market Research

The semiconductor manufacturing equipment market is projected to register a CAGR of 9.5% in the forecast period of 2023 to 2030. The new market report contains data for historic year 2021, the base year of calculation is 2022 and the forecast period is 2023 to 2030.

Market Segmentation:

Europe Semiconductor Manufacturing Equipment Market, By Equipment Type (Front End Equipment, and Back End Equipment), Dimensions (3D, 2.5D, and 2D), Product Type (Memory, MEMS, Foundry, Analog, MPU, Logic, Discrete, and Others), Supply Chain Participant (Integrated Device Manufacturer (IDM) Firms, Foundry, and Outsourced Semiconductor Assembly and Test (OSAT) Companies), Fab Facility Equipment (Factory Automation, Gas Control Equipment, Chemical Control Equipment, and Others) Country (Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe) Industry Trends and Forecast to 2030
Some of the major factors contributing to the growth of the semiconductor manufacturing equipment market are:

- Increasing consumption of consumer electronics
- Growing demand for semiconductor across the globe

Market Players
Some of the major players operating in the semiconductor manufacturing equipment market are:

- ASML, K.L.A
- Corporation.
- Plasma-Therm
- LAM RESEARCH CORPORATION.
- Veeco Instruments Inc.
- E.V. Group
- Tokyo Electron Limited
- Canon Machinery Inc.
- Nordson Corporation
- Hitachi High-Tech Corporation
- Advanced Dicing Technologies.
- Evatec AG.
- NOIVION
- Modutek.com
- QP Technologies
- Applied Materials, Inc.
- SCREEN Holdings Co., Ltd.
- Teradyne Inc.
- Onto Innovation
- ADVANTEST CORPORATION
- TOKYO SEIMITSU CO., LTD.
- SUSS MicroTec SE
- ASMPT
- FormFactor
- UNITES Systems a.s.
- Gigaphoton Inc.
- Palomar Technologies

TABLE OF CONTENTS
1 INTRODUCTION 40
1.1 OBJECTIVES OF THE STUDY 40
1.2 MARKET DEFINITION 40
1.3 OVERVIEW OF THE EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 40
1.4 CURRENCY AND PRICING 42
1.5 LIMITATIONS 42
1.6 MARKETS COVERED 42
2 MARKET SEGMENTATION 46
2.1 MARKETS COVERED 46
2.2 GEOGRAPHICAL SCOPE 47
2.3 YEARS CONSIDERED FOR THE STUDY 48
2.4 DBMR TRIPOD DATA VALIDATION MODEL 49
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 52
2.6 DBMR MARKET POSITION GRID 53
2.7 VENDOR SHARE ANALYSIS 55
2.8 MULTIVARIATE MODELING 56
2.9 COMPONENT TYPE TIMELINE CURVE 56
2.10 SECONDARY SOURCES 57
2.11 ASSUMPTIONS 57
3 EXECUTIVE SUMMARY 58
4 PREMIUM INSIGHTS 61
5 MARKET OVERVIEW 62
5.1 DRIVERS 64
5.1.1 INCREASING CONSUMPTION OF CONSUMER ELECTRONICS 64
5.1.2 GROWING DEMAND FOR SEMICONDUCTORS ACROSS THE GLOBE 65
5.1.3 EMERGENCE OF A LARGE NUMBER OF SEMICONDUCTOR MANUFACTURING FACILITIES 65
5.1.4 TECHNOLOGICAL ADVANCEMENTS AND THE ADOPTION OF INNOVATIVE TECHNOLOGIES SUCH AS ARTIFICIAL INTELLIGENCE AND BLOCKCHAIN 66
5.1.5 GROWING ADOPTION OF IOT ACROSS THE SEMICONDUCTOR INDUSTRY 67
5.2 RESTRAINTS 68
5.2.1 HIGH COMPETITION IN THE SEMICONDUCTOR MANUFACTURING MARKET 68
5.2.2 HIGH R&D COST IN THE SEMICONDUCTOR EQUIPMENT MARKET 68
5.3 OPPORTUNITIES 69
5.3.1 RISE IN DIGITAL SUPPLY CHAIN ACROSS THE GLOBE 69
5.3.2 INTRODUCTION OF KERFLESS WAFER OVER TRADITIONAL WAFER 69
5.3.3 VERY HIGH GROWTH OF THE AUTOMOBILE INDUSTRY 70
5.4 CHALLENGES 70
5.4.1 DISRUPTION IN THE SUPPLY CHAIN INDUSTRY 70
5.4.2 ENVIRONMENTAL CONCERNS RAISED DUE TO SEMICONDUCTOR PRODUCTION 71
6 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE 72
6.1 OVERVIEW 73
6.2 FRONT END EQUIPMENT 74
6.2.1 LITHOGRAPHY 75
6.2.1.1 DUV 75
6.2.1.2 EUV 75
6.2.2 DEPOSITION 75
6.2.2.1 PVD 76
6.2.2.2 CVD 76
6.2.3 WAFER SURFACE CONDITIONING 76
6.2.3.1 ETCHING 76
6.2.3.2 CHEMICAL 76
6.2.4 CLEANING 77
6.2.4.1 BATCH SPRAY CLEANING SYSTEM 77
6.2.4.2 SINGLE-WAFER SPRAY SYSTEM 77
6.2.4.3 SINGLE-WAFER CRYOGENIC SYSTEM 77
6.2.4.4 BATCH IMMERSION CLEANING SYSTEM 77
6.2.4.5 SCRUBBER 77
6.2.5 OTHER EQUIPMENT 78
6.3 BACK END EQUIPMENT 78
6.3.1 TESTING 78
6.3.2 ASSEMBLY AND PACKING 79
6.3.3 DICING EQUIPMENT 79
6.3.4 BONDING EQUIPMENT 79
6.3.5 METROLOGY 79
7 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSIONS 80
7.1 OVERVIEW 81
7.2 3D 82
7.3 2.5D 83
7.4 2D 83
8 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE 84
8.1 OVERVIEW 85
8.2 MEMORY 86
8.3 MEMS 87
8.4 FOUNDRY 87
8.5 ANALOG 88
8.6 MPU 88
8.7 LOGIC 89
8.8 DISCRETE 89
8.9 OTHERS 90
9 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT 91
9.1 OVERVIEW 92
9.2 INTEGRATED DEVICE MANUFACTURER (IDM) FIRMS 93
9.3 FOUNDRY 94
9.4 OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) COMPANIES 94
10 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY EQUIPMENT 95
10.1 OVERVIEW 96
10.2 FACTORY AUTOMATION 97
10.2.1 FRONT END EQUIPMENT 98
10.2.2 BACK END EQUIPMENT 98
10.3 GAS CONTROL EQUIPMENT 98
10.3.1 FRONT END EQUIPMENT 99
10.3.2 BACK END EQUIPMENT 99
10.4 CHEMICAL CONTROL EQUIPMENT 99
10.4.1 FRONT END EQUIPMENT 99
10.4.2 BACK END EQUIPMENT 100
10.5 OTHERS 100
11 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 101
11.1 EUROPE 102
11.1.1 GERMANY 110
11.1.2 U.K. 114
11.1.3 AUSTRIA 118
11.1.4 TURKEY 122
11.1.5 BELGIUM 127
11.1.6 RUSSIA 131
11.1.7 NETHERLANDS 135
11.1.8 ITALY 139
11.1.9 FRANCE 143
11.1.10 SWITZERLAND 147
11.1.11 REST OF EUROPE 151
12 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY LANDSCAPE 152
12.1 COMPANY SHARE ANALYSIS: EUROPE 152
13 SWOT ANALYSIS 153
14 COMPANY PROFILE 154
14.1 ASML 154
14.1.1 COMPANY SNAPSHOT 154
14.1.2 REVENUE ANALYSIS 154
14.1.3 COMPANY SHARE ANALYSIS 155
14.1.4 PRODUCT PORTFOLIO 155
14.1.5 RECENT DEVELOPMENT 155
14.2 TOKYO ELECTRON LIMITED 156
14.2.1 COMPANY SNAPSHOT 156
14.2.2 REVENUE ANALYSIS 156
14.2.3 COMPANY SHARE ANALYSIS 157
14.2.4 PRODUCT PORTFOLIO 157
14.2.5 RECENT DEVELOPMENTS 158
14.3 LAM RESEARCH CORPORATION 159
14.3.1 COMPANY SNAPSHOT 159
14.3.2 REVENUE ANALYSIS 159
14.3.3 COMPANY SHARE ANALYSIS 160
14.3.4 PRODUCT PORTFOLIO 160
14.3.5 RECENT DEVELOPMENT 161
14.4 KLA CORPORATION 162
14.4.1 COMPANY SNAPSHOT 162
14.4.2 REVENUE ANALYSIS 162
14.4.3 COMPANY SHARE ANALYSIS 163
14.4.4 PRODUCT PORTFOLIO 163
14.4.5 RECENT DEVELOPMENT 163
14.5 APPLIED MATERIALS, I.N.C. 164
14.5.1 COMPANY SNAPSHOT 164
14.5.2 REVENUE ANALYSIS 164
14.5.3 COMPANY SHARE ANALYSIS 165
14.5.4 PRODUCT AND TECHNOLOGIES PORTFOLIO 165
14.5.5 RECENT DEVELOPMENTS 167
14.6 ADVANCED DICING TECHNOLOGIES 168
14.6.1 COMPANY SNAPSHOT 168
14.6.2 PRODUCT PORTFOLIO 168
14.6.3 RECENT DEVELOPMENTS 168
14.7 ADVANTEST CORPORATION 169
14.7.1 COMPANY SNAPSHOT 169
14.7.2 REVENUE ANALYSIS 169
14.7.3 PRODUCTS PORTFOLIO 170
14.7.4 RECENT DEVELOPMENTS 171
14.8 ASMPT 172
14.8.1 COMPANY SNAPSHOT 172
14.8.2 REVENUE ANALYSIS 173
14.8.3 PRODUCTS PORTFOLIO 173
14.8.4 RECENT DEVELOPMENTS 174
14.9 CANON MACHINERY INC. 175
14.9.1 COMPANY SNAPSHOT 175
14.9.2 PRODUCT PORTFOLIO 175
14.9.3 RECENT DEVELOPMENT 176
14.10 EV GROUP 177
14.10.1 COMPANY SNAPSHOT 177
14.10.2 PRODUCT PORTFOLIO 177
14.10.3 RECENT DEVELOPMENTS 177
14.11 EVATEC AG 178
14.11.1 COMPANY SNAPSHOT 178
14.11.2 PRODUCT PORTFOLIO 178
14.11.3 RECENT DEVELOPMENT 178
14.12 FORMFACTOR. 179
14.12.1 COMPANY SNAPSHOT 179
14.12.2 REVENUE ANALYSIS 180
14.12.3 PRODUCTS PORTFOLIO 181
14.12.4 RECENT DEVELOPMENTS 181
14.13 GIGAPHOTON INC. 182
14.13.1 COMPANY SNAPSHOT 182
14.13.2 PRODUCTS PORTFOLIO 182
14.13.3 RECENT DEVELOPMENTS 183
14.14 HITACHI HIGH-TECH CORPORATION 184
14.14.1 COMPANY SNAPSHOT 184
14.14.2 PRODUCT PORTFOLIO 184
14.14.3 RECENT DEVELOPMENTS 184
14.15 MODUTEK CORPORATION 185
14.15.1 COMPANY SNAPSHOT 185
14.15.2 PRODUCT PORTFOLIO 185
14.15.3 RECENT DEVELOPMENTS 186
14.16 NOIVION S.R.L. 187
14.16.1 COMPANY SNAPSHOT 187
14.16.2 PRODUCT PORTFOLIO 187
14.16.3 RECENT DEVELOPMENTS 187
14.17 NORDSON CORPORATION 188
14.17.1 COMPANY SNAPSHOT 188
14.17.2 REVENUE ANALYSIS 188
14.17.3 PRODUCT PORTFOLIO 189
14.17.4 RECENT DEVELOPMENTS 189
14.18 ONTO INNOVATION. 190
14.18.1 COMPANY SNAPSHOT 190
14.18.2 REVENUE ANALYSIS 191
14.18.3 PRODUCTS PORTFOLIO 192
14.18.4 RECENT DEVELOPMENTS 192
14.19 PALOMAR TECHNOLOGIES 193
14.19.1 COMPANY SNAPSHOT 193
14.19.2 PRODUCTS PORTFOLIO 193
14.19.3 RECENT DEVELOPMENTS 194
14.20 PLASMA-THERM 195
14.20.1 COMPANY SNAPSHOT 195
14.20.2 PRODUCT PORTFOLIO 195
14.20.3 RECENT DEVELOPMENTS 196
14.21 QP TECHNOLOGIES 197
14.21.1 COMPANY SNAPSHOT 197
14.21.2 SERVICE PORTFOLIO 197
14.21.3 RECENT DEVELOPMENT 198
14.22 SCREEN HOLDINGS CO., LTD. 199
14.22.1 COMPANY SNAPSHOT 199
14.22.2 REVENUE ANALYSIS 200
14.22.3 PRODUCTS PORTFOLIO 201
14.22.4 RECENT DEVELOPMENTS 202
14.23 SUSS MICROTEC SE 203
14.23.1 COMPANY SNAPSHOT 203
14.23.2 REVENUE ANALYSIS 203
14.23.3 PRODUCT PORTFOLIO 204
14.23.4 RECENT DEVELOPMENTS 205
14.24 TERADYNE INC. 206
14.24.1 COMPANY SNAPSHOT 206
14.24.2 REVENUE ANALYSIS 206
14.24.3 PRODUCTS PORTFOLIO 207
14.24.4 RECENT DEVELOPMENTS 208
14.25 TOKYO SEIMITSU CO., LTD 209
14.25.1 COMPANY SNAPSHOT 209
14.25.2 REVENUE ANALYSIS 209
14.25.3 PRODUCTS PORTFOLIO 210
14.25.4 RECENT DEVELOPMENTS 212
14.26 UNITES SYSTEMS A.S. 213
14.26.1 COMPANY SNAPSHOT 213
14.26.2 PRODUCT PORTFOLIO 213
14.26.3 RECENT DEVELOPMENTS 214
14.27 VEECO INSTRUMENTS INC. 215
14.27.1 COMPANY SNAPSHOT 215
14.27.2 REVENUE ANALYSIS 215
14.27.3 PRODUCT PORTFOLIO 216
14.27.4 RECENT DEVELOPMENT 216
15 QUESTIONNAIRE 217
16 RELATED REPORTS 219

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