APAC SiC Power Semiconductor Market - Industry Trends and Forecast to 2030
Market Report I 2022-12-01 I 193 Pages I Data Bridge Market Research
Asia-Pacific SiC power semiconductor market is projected to register a CAGR of 25.9% in the forecast period of 2023 to 2030. The new market report contains data for the historic year 2021, the base year of calculation is 2022, and the forecast period is 2023 to 2030.
Market Segmentation:
Asia-Pacific SiC Power Semiconductor Market, By Type (MOSFETS, Hybrid Modules, Schottky Barrier Diodes (SBDS), IGBT, Bipolar Junction Transistor (BJT), Pin Diode, Junction FET (JFET), and Others), Voltage Range (301-900 V, 901-1700 V, Above 1701 V), Wafer size (6 Inch, 4 Inch, 2 Inch, Above 6 Inch), Wafer type (SiC Epitaxial Wafers, Blank SiC Wafers), Application (Electric Vehicles (EV), Photovoltaics, Power Supplies, Industrial Motor Drives, EV Charging Infrastructure, RF Devices, and Others), Vertical (Automotive, Utilities and Energy, Industrial, Transportation, IT and Telecommunication, Consumer Electronics, Aerospace and Defense, Commercial, and Others), Country (China, South Korea, Japan, India, Australia, Singapore, Thailand, Indonesia, Malaysia, Philippines, and Rest of Asia-Pacific), Industry Trends and Forecast To 2030
Some of the major factors contributing to the growth of the Asia-Pacific SiC power semiconductor market are:
- Increasing usage of SiC power modules and related devices.
- Rising penetration of electronic vehicles
Market Players:
Some of the major players operating in the Asia-Pacific SiC power semiconductor market are:
- WOLFSPEED, INC.
- STMicroelectronics
- ROHM CO., LTD.
- Fuji Electric Co., Ltd.
- Mitsubishi Electric Corporation
- Texas Instruments Incorporated
- Infineon Technologies AG
- SEMIKRON
- Xiamen Powerway Advanced Material Co., Ltd.
- Renesas Electronics Corporation
- TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Microchip Technology Inc.
- Semiconductor Components Industries, LLC
- NXP Semiconductors
- UnitedSiC
- SemiQ Inc.
- Littlefuse, Inc.
- Allegro MicroSystems, Inc.
- Hitachi Power Semiconductor Device, Ltd. (A Subsidiary of Hitachi Group)
- GeneSiC Semiconductor Inc.
TABLE OF CONTENTS
1 INTRODUCTION 16
1.1 OBJECTIVES OF THE STUDY 16
1.2 MARKET DEFINITION 16
1.3 OVERVIEW OF THE ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET 16
1.4 CURRENCY AND PRICING 18
1.5 LIMITATIONS 19
1.6 MARKET COVERED 19
2 MARKET SEGMENTATION 23
2.1 MARKETS COVERED 23
2.2 YEARS CONSIDERED FOR THE STUDY 24
2.3 GEOGRAPHIC SCOPE 25
2.4 DBMR TRIPOD DATA VALIDATION MODEL 26
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 29
2.6 DBMR MARKET POSITION GRID 30
2.7 VENDOR SHARE ANALYSIS 32
2.8 MULTIVARIATE MODELLING 33
2.9 TYPE CURVE 34
2.10 MARKET APPLICATION COVERAGE GRID 34
2.11 SECONDARY SOURCES 36
2.12 ASSUMPTIONS 36
3 EXECUTIVE SUMMARY 37
4 PREMIUM INSIGHTS 40
5 MARKET OVERVIEW 41
5.1 DRIVERS 43
5.1.1 ADVENT OF SIC POWER SEMICONDUCTORS 43
5.1.2 RISING PENETRATION OF ELECTRONIC VEHICLES 44
5.1.3 INCREASING USAGE OF PHOTOVOLTAIC TECHNOLOGIES 45
5.1.4 RISING GROWTH OF SEMICONDUCTOR INDUSTRY 45
5.1.5 RISING DEPLOYMENT OF WBG POWER SEMICONDUCTORS IN DATA CENTERS 46
5.2 RESTRAINTS 47
5.2.1 HIGH COST ASSOCIATED WITH SIC SUBSTRATES 47
5.3 OPPORTUNITIES 48
5.3.1 STRATEGIC PARTNERSHIP AND ACQUISITION BY SIC MANUFACTURERS 48
5.3.2 GROWING SUPPLY CHAIN CAPABILITIES IN NORTH AMERICA AND EUROPE 48
5.3.3 IMPLEMENTATION OF SIC TECHNOLOGY IN THE ENERGY SECTOR 49
5.3.4 STRONG INITIATIVES AND INVESTMENTS TAKEN BY THE GOVERNMENT/COMPANIES TO BOOST SEMICONDUCTOR MARKET. 50
5.4 CHALLENGES 51
5.4.1 ISSUES RELATED WITH SIC WAFER MANUFACTURING 51
5.4.2 SHORTAGE OF SILICON CARBIDE SEMICONDUCTORS DUE TO DISRUPTED SUPPLY CHAIN 51
6 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY TYPE 53
6.1 OVERVIEW 54
6.2 MOSFETS 56
6.3 HYBRID MODULES 57
6.4 SCHOTTKY BARRIER DIODES (SBDS) 58
6.5 IGBT 59
6.6 BIPOLAR JUNCTION TRANSISTOR (BJT) 60
6.7 PIN DIODE 61
6.8 JUNCTION FET (JFET) 62
6.9 OTHERS 63
7 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY VOLTAGE RANGE 64
7.1 OVERVIEW 65
7.2 301-900 V 66
7.3 901-1700 V 67
7.4 ABOVE 1701 V 68
8 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY WAFER SIZE 69
8.1 OVERVIEW 70
8.2 6 INCH 71
8.3 4 INCH 72
8.4 2 INCH 72
8.5 ABOVE 6 INCH 73
9 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY WAFER TYPE 74
9.1 OVERVIEW 75
9.2 SIC EPITAXIAL WAFERS 76
9.3 BLANK SIC WAFERS 77
10 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY APPLICATION 78
10.1 OVERVIEW 79
10.2 ELECTRIC VEHICLES 80
10.3 PHOTOVOLTAICS 81
10.4 POWER SUPPLIES 82
10.5 INDUSTRIAL MOTOR DRIVES 82
10.6 EV CHARGING INFRASTRUCTURE 83
10.7 RF DEVICES 84
10.8 OTHERS 85
11 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY VERTICAL 86
11.1 OVERVIEW 87
11.2 AUTOMOTIVE 88
11.3 UTILITIES AND ENERGY 89
11.4 INDUSTRIAL 90
11.5 TRANSPORTATION 91
11.6 IT AND TELECOMMUNICATION 92
11.7 CONSUMER ELECTRONICS 93
11.8 AEROSPACE AND DEFENSE 93
11.9 COMMERCIAL 94
11.10 OTHERS 95
12 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, BY REGION 96
12.1 ASIA-PACIFIC 97
12.1.1 CHINA 103
12.1.2 JAPAN 105
12.1.3 SOUTH KOREA 107
12.1.4 INDIA 109
12.1.5 TAIWAN 111
12.1.6 AUSTRALIA AND NEW ZEALAND 113
12.1.7 SINGAPORE 115
12.1.8 THAILAND 117
12.1.9 INDONESIA 119
12.1.10 MALAYSIA 121
12.1.11 PHILIPPINES 123
12.1.12 VIETNAM 125
12.1.13 REST OF ASIA-PACIFIC 127
13 ASIA PACIFIC SIC POWER SEMICONDUCTOR MARKET, COMPANY LANDSCAPE 128
13.1 COMPANY SHARE ANALYSIS: ASIA PACIFIC 128
14 SWOT ANALYSIS 129
15 COMPANY PROFILINGS 130
15.1 STMICROELECTRONICS 130
15.1.1 COMPANY SNAPSHOT 130
15.1.2 REVENUE ANALYSIS 131
15.1.3 COMPANY SHARE ANALYSIS 131
15.1.4 PRODUCT PORTFOLIO 131
15.1.5 RECENT DEVELOPMENTS 132
15.2 INFINEON TECHNOLOGIES AG 134
15.2.1 COMPANY SNAPSHOT 134
15.2.2 REVENUE ANALYSIS 135
15.2.3 COMPANY SHARE ANALYSIS 135
15.2.4 PRODUCT PORTFOLIO 136
15.2.5 RECENT DEVELOPMENTS 136
15.3 WOLFSPEED INC. 138
15.3.1 COMPANY SNAPSHOT 138
15.3.2 REVENUE ANALYSIS 138
15.3.3 COMPANY SHARE ANALYSIS 139
15.3.4 PRODUCT PORTFOLIO 139
15.3.5 RECENT DEVELOPMENTS 140
15.4 ROHM CO., LTD. 142
15.4.1 COMPANY SNAPSHOT 142
15.4.2 REVENUE ANALYSIS 142
15.4.3 COMPANY SHARE ANALYSIS 143
15.4.4 PRODUCT PORTFOLIO 143
15.4.5 RECENT DEVELOPMENTS 144
15.5 SEMICONDUCTOR COMPONENTS INDUSTRIES LLC 146
15.5.1 COMPANY SNAPSHOT 146
15.5.2 REVENUE ANALYSIS 146
15.5.3 COMPANY SHARE ANALYSIS 147
15.5.4 PRODUCT PORTFOLIO 147
15.5.5 RECENT DEVELOPMENTS 148
15.6 ALLEGRO MICROSYSTEMS, INC. 150
15.6.1 COMPANY SNAPSHOT 150
15.6.2 REVENUE ANALYSIS 150
15.6.3 COMPANY SHARE ANALYSIS 151
15.6.4 PRODUCT PORTFOLIO 151
15.6.5 RECENT DEVELOPMENTS 151
15.7 FUJI ELECTRIC CO. LTD. 154
15.7.1 COMPANY SNAPSHOT 154
15.7.2 REVENUE ANALYSIS 154
15.7.3 PRODUCT PORTFOLIO 155
15.7.4 RECENT DEVELOPMENTS 155
15.8 GENESIC SEMICONDUCTOR INC. 156
15.8.1 COMPANY SNAPSHOT 156
15.8.2 PRODUCT PORTFOLIO 156
15.8.3 RECENT DEVELOPMENTS 156
15.9 HITACHI POWER SEMICONDUCTOR DEVICE, LTD. 159
15.9.1 COMPANY SNAPSHOT 159
15.9.2 PRODUCT PORTFOLIO 159
15.9.3 RECENT DEVELOPMENTS 159
15.10 LITTLEFUSE, INC. 161
15.10.1 COMPANY SNAPSHOT 161
15.10.2 REVENUE ANALYSIS 161
15.10.3 PRODUCT PORTFOLIO 162
15.10.4 RECENT DEVELOPMENTS 162
15.11 MICROCHIP TECHNOLOGY INC. 164
15.11.1 COMPANY SNAPSHOT 164
15.11.2 REVENUE ANALYSIS 164
15.11.3 PRODUCT PORTFOLIO 165
15.11.4 RECENT DEVELOPMENTS 165
15.12 MITSUBISHI ELECTRIC CORPORATION 167
15.12.1 COMPANY SNAPSHOT 167
15.12.2 REVENUE ANALYSIS 167
15.12.3 PRODUCT PORTFOLIO 168
15.12.4 RECENT DEVELOPMENTS 168
15.13 NXP SEMICONDUCTORS 170
15.13.1 COMPANY SNAPSHOT 170
15.13.2 REVENUE ANALYSIS 170
15.13.3 DESIGN PORTFOLIO 171
15.13.4 RECENT DEVELOPMENTS 171
15.14 RENESAS ELECTRONICS CORPORATION 173
15.14.1 COMPANY SNAPSHOT 173
15.14.2 REVENUE ANALYSIS 173
15.14.3 PRODUCT PORTFOLIO 174
15.14.4 RECENT DEVELOPMENTS 174
15.15 SEMIKRON DANFOSS 176
15.15.1 COMPANY SNAPSHOT 176
15.15.2 PRODUCT PORTFOLIO 176
15.15.3 RECENT DEVELOPMENTS 176
15.16 SEMIQ INC. 178
15.16.1 COMPANY SNAPSHOT 178
15.16.2 PRODUCT PORTFOLIO 178
15.16.3 RECENT DEVELOPMENTS 179
15.17 TEXAS INSTRUMENTS INCORPORATED 181
15.17.1 COMPANY SNAPSHOT 181
15.17.2 REVENUE ANALYSIS 181
15.17.3 PRODUCT PORTFOLIO 182
15.17.4 RECENT DEVELOPMENTS 182
15.18 TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION 184
15.18.1 COMPANY SNAPSHOT 184
15.18.2 PRODUCTS PORTFOLIO 184
15.18.3 RECENT DEVELOPMENTS 184
15.19 UNITEDSIC 186
15.19.1 COMPANY SNAPSHOT 186
15.19.2 PRODUCT PORTFOLIO 186
15.19.3 RECENT DEVELOPMENTS 186
15.20 XIAMEN POWERWAY ADVANCED MATERIAL CO. LTD. 188
15.20.1 COMPANY SNAPSHOT 188
15.20.2 PRODUCT PORTFOLIO 188
15.20.3 RECENT DEVELOPMENTS 188
16 QUESTIONNAIRE 189
17 RELATED REPORTS 193
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