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Report
APAC Semiconductor Manufacturing Equipment Market - Industry Trends and Forecast to 2030
Market Report I 2022-11-01 I 220 Pages I Data Bridge Market Research
The semiconductor manufacturing equipment market is projected to register a CAGR of 9.5% in the forecast period of 2023 to 2030. The new market report contains data for historic year 2021, the base year of calculation is 2022 and the forecast period is 2023 to 2030.
Market Segmentation:
Asia-Pacific Semiconductor Manufacturing Equipment Market, By Equipment Type (Front End Equipment, and Back End Equipment), Dimensions (3D, 2.5D, and 2D), Product Type (Memory, MEMS, Foundry, Analog, MPU, Logic, Discrete, and Others), Supply Chain Participant (Integrated Device Manufacturer (IDM) Firms, Foundry, and Outsourced Semiconductor Assembly and Test (OSAT) Companies), Fab Facility Equipment (Factory Automation, Gas Control Equipment, Chemical Control Equipment, and Others) Country (China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC)) Industry Trends and Forecast to 2030
Some of the major factors contributing to the growth of the semiconductor manufacturing equipment market are:
? Increasing consumption of consumer electronics
? Growing demand for semiconductor across the globe
Market Players
Some of the major players operating in the semiconductor manufacturing equipment market are:
- ASML, K.L.A
- Corporation.
- Plasma-Therm
- LAM RESEARCH CORPORATION.
- Veeco Instruments Inc.
- E.V. Group
- Tokyo Electron Limited
- Canon Machinery Inc.
- Nordson Corporation
- Hitachi High-Tech Corporation
- Advanced Dicing Technologies.
- Evatec AG.
- NOIVION
- Modutek.com
- QP Technologies
- Applied Materials, Inc.
- SCREEN Holdings Co., Ltd.
- Teradyne Inc.
- Onto Innovation
- ADVANTEST CORPORATION
- TOKYO SEIMITSU CO., LTD.
- SUSS MicroTec SE
- ASMPT
- FormFactor
- UNITES Systems a.s.
- Gigaphoton Inc.
- Palomar Technologies
TABLE OF CONTENTS
1 INTRODUCTION 40
1.1 OBJECTIVES OF THE STUDY 40
1.2 MARKET DEFINITION 40
1.3 OVERVIEW OF THE ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 40
1.4 CURRENCY AND PRICING 42
1.5 LIMITATIONS 42
1.6 MARKETS COVERED 42
2 MARKET SEGMENTATION 46
2.1 MARKETS COVERED 46
2.2 GEOGRAPHICAL SCOPE 47
2.3 YEARS CONSIDERED FOR THE STUDY 48
2.4 DBMR TRIPOD DATA VALIDATION MODEL 49
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 52
2.6 DBMR MARKET POSITION GRID 53
2.7 VENDOR SHARE ANALYSIS 55
2.8 MULTIVARIATE MODELING 56
2.9 COMPONENT TYPE TIMELINE CURVE 56
2.10 SECONDARY SOURCES 57
2.11 ASSUMPTIONS 57
3 EXECUTIVE SUMMARY 58
4 PREMIUM INSIGHTS 61
5 MARKET OVERVIEW 62
5.1 DRIVERS 64
5.1.1 INCREASING CONSUMPTION OF CONSUMER ELECTRONICS 64
5.1.2 GROWING DEMAND FOR SEMICONDUCTORS ACROSS THE GLOBE 65
5.1.3 EMERGENCE OF A LARGE NUMBER OF SEMICONDUCTOR MANUFACTURING FACILITIES 65
5.1.4 TECHNOLOGICAL ADVANCEMENTS AND THE ADOPTION OF INNOVATIVE TECHNOLOGIES SUCH AS ARTIFICIAL INTELLIGENCE AND BLOCKCHAIN 66
5.1.5 GROWING ADOPTION OF IOT ACROSS THE SEMICONDUCTOR INDUSTRY 67
5.2 RESTRAINTS 68
5.2.1 HIGH COMPETITION IN THE SEMICONDUCTOR MANUFACTURING MARKET 68
5.2.2 HIGH R&D COST IN THE SEMICONDUCTOR EQUIPMENT MARKET 68
5.3 OPPORTUNITIES 69
5.3.1 RISE IN DIGITAL SUPPLY CHAIN ACROSS THE GLOBE 69
5.3.2 INTRODUCTION OF KERFLESS WAFER OVER TRADITIONAL WAFER 69
5.3.3 VERY HIGH GROWTH OF THE AUTOMOBILE INDUSTRY 70
5.4 CHALLENGES 70
5.4.1 DISRUPTION IN THE SUPPLY CHAIN INDUSTRY 70
5.4.2 ENVIRONMENTAL CONCERNS RAISED DUE TO SEMICONDUCTOR PRODUCTION 71
6 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE 72
6.1 OVERVIEW 73
6.2 FRONT END EQUIPMENT 74
6.2.1 LITHOGRAPHY 75
6.2.1.1 DUV 75
6.2.1.2 EUV 75
6.2.2 DEPOSITION 75
6.2.2.1 PVD 76
6.2.2.2 CVD 76
6.2.3 WAFER SURFACE CONDITIONING 76
6.2.3.1 ETCHING 76
6.2.3.2 CHEMICAL 76
6.2.4 CLEANING 77
6.2.4.1 BATCH SPRAY CLEANING SYSTEM 77
6.2.4.2 SINGLE-WAFER SPRAY SYSTEM 77
6.2.4.3 SINGLE-WAFER CRYOGENIC SYSTEM 77
6.2.4.4 BATCH IMMERSION CLEANING SYSTEM 77
6.2.4.5 SCRUBBER 77
6.2.5 OTHER EQUIPMENT 78
6.3 BACK END EQUIPMENT 78
6.3.1 TESTING 78
6.3.2 ASSEMBLY AND PACKING 79
6.3.3 DICING EQUIPMENT 79
6.3.4 BONDING EQUIPMENT 79
6.3.5 METROLOGY 79
7 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSIONS 80
7.1 OVERVIEW 81
7.2 3D 82
7.3 2.5D 83
7.4 2D 83
8 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE 84
8.1 OVERVIEW 85
8.2 MEMORY 86
8.3 MEMS 87
8.4 FOUNDRY 87
8.5 ANALOG 88
8.6 MPU 88
8.7 LOGIC 89
8.8 DISCRETE 89
8.9 OTHERS 90
9 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT 91
9.1 OVERVIEW 92
9.2 INTEGRATED DEVICE MANUFACTURER (IDM) FIRMS 93
9.3 FOUNDRY 94
9.4 OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) COMPANIES 94
10 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY EQUIPMENT 95
10.1 OVERVIEW 96
10.2 FACTORY AUTOMATION 97
10.2.1 FRONT END EQUIPMENT 98
10.2.2 BACK END EQUIPMENT 98
10.3 GAS CONTROL EQUIPMENT 98
10.3.1 FRONT END EQUIPMENT 99
10.3.2 BACK END EQUIPMENT 99
10.4 CHEMICAL CONTROL EQUIPMENT 99
10.4.1 FRONT END EQUIPMENT 99
10.4.2 BACK END EQUIPMENT 100
10.5 OTHERS 100
11 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 101
11.1 ASIA-PACIFIC 102
11.1.1 CHINA 110
11.1.2 TAIWAN 114
11.1.3 JAPAN 118
11.1.4 SOUTH KOREA 122
11.1.5 SINGAPORE 126
11.1.6 AUSTRALIA 130
11.1.7 INDIA 134
11.1.8 THAILAND 139
11.1.9 MALAYSIA 144
11.1.10 PHILIPPINES 148
11.1.11 REST OF ASIA-PACIFIC 152
12 ASIA PACIFIC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY LANDSCAPE 153
12.1 COMPANY SHARE ANALYSIS: ASIA PACIFIC 153
13 SWOT ANALYSIS 154
14 COMPANY PROFILE 155
14.1 ASML 155
14.1.1 COMPANY SNAPSHOT 155
14.1.2 REVENUE ANALYSIS 155
14.1.3 COMPANY SHARE ANALYSIS 156
14.1.4 PRODUCT PORTFOLIO 156
14.1.5 RECENT DEVELOPMENT 156
14.2 TOKYO ELECTRON LIMITED 157
14.2.1 COMPANY SNAPSHOT 157
14.2.2 REVENUE ANALYSIS 157
14.2.3 COMPANY SHARE ANALYSIS 158
14.2.4 PRODUCT PORTFOLIO 158
14.2.5 RECENT DEVELOPMENTS 159
14.3 LAM RESEARCH CORPORATION 160
14.3.1 COMPANY SNAPSHOT 160
14.3.2 REVENUE ANALYSIS 160
14.3.3 COMPANY SHARE ANALYSIS 161
14.3.4 PRODUCT PORTFOLIO 161
14.3.5 RECENT DEVELOPMENT 162
14.4 KLA CORPORATION 163
14.4.1 COMPANY SNAPSHOT 163
14.4.2 REVENUE ANALYSIS 163
14.4.3 COMPANY SHARE ANALYSIS 164
14.4.4 PRODUCT PORTFOLIO 164
14.4.5 RECENT DEVELOPMENT 164
14.5 APPLIED MATERIALS, I.N.C. 165
14.5.1 COMPANY SNAPSHOT 165
14.5.2 REVENUE ANALYSIS 165
14.5.3 COMPANY SHARE ANALYSIS 166
14.5.4 PRODUCT AND TECHNOLOGIES PORTFOLIO 166
14.5.5 RECENT DEVELOPMENTS 168
14.6 ADVANCED DICING TECHNOLOGIES 169
14.6.1 COMPANY SNAPSHOT 169
14.6.2 PRODUCT PORTFOLIO 169
14.6.3 RECENT DEVELOPMENTS 169
14.7 ADVANTEST CORPORATION 170
14.7.1 COMPANY SNAPSHOT 170
14.7.2 REVENUE ANALYSIS 170
14.7.3 PRODUCTS PORTFOLIO 171
14.7.4 RECENT DEVELOPMENTS 172
14.8 ASMPT 173
14.8.1 COMPANY SNAPSHOT 173
14.8.2 REVENUE ANALYSIS 174
14.8.3 PRODUCTS PORTFOLIO 174
14.8.4 RECENT DEVELOPMENTS 175
14.9 CANON MACHINERY INC. 176
14.9.1 COMPANY SNAPSHOT 176
14.9.2 PRODUCT PORTFOLIO 176
14.9.3 RECENT DEVELOPMENT 177
14.10 EV GROUP 178
14.10.1 COMPANY SNAPSHOT 178
14.10.2 PRODUCT PORTFOLIO 178
14.10.3 RECENT DEVELOPMENTS 178
14.11 EVATEC AG 179
14.11.1 COMPANY SNAPSHOT 179
14.11.2 PRODUCT PORTFOLIO 179
14.11.3 RECENT DEVELOPMENT 179
14.12 FORMFACTOR. 180
14.12.1 COMPANY SNAPSHOT 180
14.12.2 REVENUE ANALYSIS 181
14.12.3 PRODUCTS PORTFOLIO 182
14.12.4 RECENT DEVELOPMENTS 182
14.13 GIGAPHOTON INC. 183
14.13.1 COMPANY SNAPSHOT 183
14.13.2 PRODUCTS PORTFOLIO 183
14.13.3 RECENT DEVELOPMENTS 184
14.14 HITACHI HIGH-TECH CORPORATION 185
14.14.1 COMPANY SNAPSHOT 185
14.14.2 PRODUCT PORTFOLIO 185
14.14.3 RECENT DEVELOPMENTS 185
14.15 MODUTEK CORPORATION 186
14.15.1 COMPANY SNAPSHOT 186
14.15.2 PRODUCT PORTFOLIO 186
14.15.3 RECENT DEVELOPMENTS 187
14.16 NOIVION S.R.L. 188
14.16.1 COMPANY SNAPSHOT 188
14.16.2 PRODUCT PORTFOLIO 188
14.16.3 RECENT DEVELOPMENTS 188
14.17 NORDSON CORPORATION 189
14.17.1 COMPANY SNAPSHOT 189
14.17.2 REVENUE ANALYSIS 189
14.17.3 PRODUCT PORTFOLIO 190
14.17.4 RECENT DEVELOPMENTS 190
14.18 ONTO INNOVATION. 191
14.18.1 COMPANY SNAPSHOT 191
14.18.2 REVENUE ANALYSIS 192
14.18.3 PRODUCTS PORTFOLIO 193
14.18.4 RECENT DEVELOPMENTS 193
14.19 PALOMAR TECHNOLOGIES 194
14.19.1 COMPANY SNAPSHOT 194
14.19.2 PRODUCTS PORTFOLIO 194
14.19.3 RECENT DEVELOPMENTS 195
14.20 PLASMA-THERM 196
14.20.1 COMPANY SNAPSHOT 196
14.20.2 PRODUCT PORTFOLIO 196
14.20.3 RECENT DEVELOPMENTS 197
14.21 QP TECHNOLOGIES 198
14.21.1 COMPANY SNAPSHOT 198
14.21.2 SERVICE PORTFOLIO 198
14.21.3 RECENT DEVELOPMENT 199
14.22 SCREEN HOLDINGS CO., LTD. 200
14.22.1 COMPANY SNAPSHOT 200
14.22.2 REVENUE ANALYSIS 201
14.22.3 PRODUCTS PORTFOLIO 202
14.22.4 RECENT DEVELOPMENTS 203
14.23 SUSS MICROTEC SE 204
14.23.1 COMPANY SNAPSHOT 204
14.23.2 REVENUE ANALYSIS 204
14.23.3 PRODUCT PORTFOLIO 205
14.23.4 RECENT DEVELOPMENTS 206
14.24 TERADYNE INC. 207
14.24.1 COMPANY SNAPSHOT 207
14.24.2 REVENUE ANALYSIS 207
14.24.3 PRODUCTS PORTFOLIO 208
14.24.4 RECENT DEVELOPMENTS 209
14.25 TOKYO SEIMITSU CO., LTD 210
14.25.1 COMPANY SNAPSHOT 210
14.25.2 REVENUE ANALYSIS 210
14.25.3 PRODUCTS PORTFOLIO 211
14.25.4 RECENT DEVELOPMENTS 213
14.26 UNITES SYSTEMS A.S. 214
14.26.1 COMPANY SNAPSHOT 214
14.26.2 PRODUCT PORTFOLIO 214
14.26.3 RECENT DEVELOPMENTS 215
14.27 VEECO INSTRUMENTS INC. 216
14.27.1 COMPANY SNAPSHOT 216
14.27.2 REVENUE ANALYSIS 216
14.27.3 PRODUCT PORTFOLIO 217
14.27.4 RECENT DEVELOPMENT 217
15 QUESTIONNAIRE 218
16 RELATED REPORTS 220
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