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Report
2024 Semiconductor Manufacturing Research Review
Market Research Report I 2025-03-06 I 96 Pages I BCC Research
Description
Research Review Scope
This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.
Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .
Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2024:
- SMC137A Global Chiplets Market
- SMC057D Global Markets, Technologies and Materials for Thin and Ultrathin Films
- SMC135A Global IoT Chips Market
- SMC136A High-speed Data Converters: Global Markets and Growth Forecast
- SMC103D Printed Circuit Boards: Technologies and Global Markets
After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.
Executive Summary
Summary:
- The global market for chiplets was valued at $5.3 billion in 2023 and is expected to reach $42.8 billion by the end of 2029, at a compound annual growth rate (CAGR) 41.9% from 2024 through 2029.
- The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028.
- The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.
This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, highspeed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), highperformance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.
Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .
Table of Contents
Chapter 1 Foreword
Research Review Scope
Chapter 2 Global Chiplets Market (SMC137A)
Chiplets
Market Outlook
Scope of the Report
Market Summary
Market Dynamics
Emerging Technologies
Segmental Analysis
Regional Analysis
Conclusion
Market Overview of Chiplets
Market Driver
High-Performance Computing
Market Restraint/Challenge
Shortage of Skilled Labor
Market Opportunity
Continuing Investment in the Semiconductor Industry
Regulatory Landscape
North America
Emerging Technologies
Heterogeneous Integration
Market Breakdown of Chiplets by Processor
CPUs
Graphics Processing Units
Field-Programmable Gate Arrays
AI-ASIC Coprocessors
Application Processing Units
Market Breakdown of Chiplets by Region
North America
Europe
Asia-Pacific
Rest of the World
Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)
Thin and Ultrathin Films
Market Outlook
Scope of Report
Market Summary
Technological Advancements and Applications
Market Dynamics and Growth Factors
Future Trends and Developments
Segmental Analysis
Regional Insights and Emerging Markets
Conclusion
Market Overview of Thin and Ultrathin Films
Market Driver
Growing Global Fabrication Equipment Spending
Market Restraint
Implications of Thin-Film Contamination
Market Opportunity
Technological Advancements and New Product Development
Key Emerging Technology and Market Trend
Laser-Based Directed Energy Deposition
Market Breakdown of Thin and Ultrathin Films by Material
Metal
Dielectric
Compounds
Others
Market Breakdown of Thin and Ultrathin Films by Region
North America
Europe
Asia-Pacific
Rest of the World
Sustainability in Thin and Ultrathin Films Industry: An ESG Perspective
Key ESG Issues in Thin and Ultrathin Films Market
ESG Performance Analysis
Current Status of ESG in the Thin and Ultrathin Films Market
ESG Practices in the Global Thin and Ultrathin Films Market
Concluding Remarks from BCC Research
Chapter 4 Global IoT Chips Market (SMC135A)
IoT Chips
Market Outlook
Scope of Report
Market Summary
Market Overview of IoT Chips
Market Driver
Growing Demand for IoT-based Vehicles
Market Restraint
Security and Privacy Concerns
Market Opportunity
Implementation of Emerging Technologies
Market Breakdown of IoT Chips by End-use Industry
Healthcare
Consumer Electronics
Automotive
Building Automation
Industrial
Others
Market Breakdown of IoT Chips by Region
North America
Europe
Asia-Pacific
Rest of the World
Sustainability in IoT Chips Industry: An ESG Perspective
ESG Issues in the IoT Chip Market
IoT Chip ESG Performance Analysis
Concluding Remarks from BCC Research
Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)
High-speed Data Converters
Market Outlook
Market Summary
Technological Advancements and Applications
Market Dynamics and Growth Factors of High-speed Data Converters
Segmental Analysis
Regional Insights and Emerging Markets
Conclusion
Technology Overview
Current and Future Market Overview of High-speed Data Converters
Market Driver
Widespread Adoption of Medical Imaging Applications
Market Challenge
Developing Low-Power High-Speed Data Converters
Market Opportunity
Rise of Autonomous Vehicles
Emerging Technologies and Developments
Miniaturization and Continuous Improvements in Semiconductor Technologies
Market Breakdown of High-Speed Data Converters by Type
A/D Converters (ADC)
D/A Converters (DAC)
Market Breakdown of High-Speed Data Converters by Region
North America
Europe
Asia-Pacific
Rest of the World
Sustainability in High-Speed Data Converters Industry: An ESG Perspective
ESG Performance Analysis
Current Status of ESG in the Global Market
ESG Practices in the High-Speed Data Converters Market
Concluding Remarks from BCC Research
Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)
Printed Circuit Boards
Market Outlook
Scope of Report
Market Summary
Technological Advances and Applications
Market Dynamics of Printed Circuit Boards
Segmental Analysis
Regional Insights and Emerging Markets
Conclusion
Current and Future Market
Market Driver
Growing Use of Autonomous Vehicles (AVs) and EVs
Market Challenge
Increasing Technological Complexity and Pressure to Continuously Innovate
Market Opportunity
Advancements in Flexible and Wearable Electronics
Emerging Technologies and Trends
3D Printing
Market Breakdown of Printed Circuit Boards by PCB Type
Single-layer
Double-layer
Multilayer
High-density Interconnect (HDI)
Market Breakdown of Printed Circuit Boards by Region
North America
Europe
Asia-Pacific
Rest of the World
Sustainability in the PCB Industry: An ESG Perspective
Status of ESG in the PCB Industry
ESG Practices in the PCB Industry
Concluding Remarks from BCC Research
Chapter 7 Appendix
Methodology
Analyst's Credentials
List of Tables
Table 1 : Global Market for Chiplets, by Region, Through 2029
Table 2 : Global Market for Chiplets, by Processor, Through 2029
Table 3 : Global Market for Chiplets, by Region, Through 2029
Table 4 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
Table 5 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
Table 6 : Global Market for Thin and Ultrathin Films, by Region, Through 2028
Table 7 : Environmental Impact
Table 8 : Social Impact
Table 9 : Governance Impact
Table 10 : Global Thin and Ultrathin Films Market, ESG Risk Ratings Metric, 2022
Table 11 : Global Market for IoT Chips, by End-use Industry, Through 2028
Table 12 : Global Market for IoT Chips, by End-use Industry, Through 2028
Table 13 : Global Market for IoT Chips, by Region, Through 2028
Table 14 : Environmental Metrics for the IoT Chip Market
Table 15 : Social Metrics for the IoT Chip Market
Table 16 : Governance Metrics for the IoT Chip Market
Table 17 : Global Market for High-Speed Data Converters, by Type, Through 2029
Table 18 : Global Market for High-Speed Data Converters, by Type, Through 2029
Table 19 : Global Market Volume for High-Speed Data Converters, by Type, Through 2029
Table 20 : Global Market for High-Speed Data Converters, by Region, Through 2029
Table 21 : Global Market Volume for High-Speed Data Converters, by Region, Through 2029
Table 22 : Environmental Metrics for the High-Speed Data Converters Market
Table 23 : Social Metrics for the High-Speed Data Converters Market
Table 24 : Governance Metrics for the High-Speed Data Converters Market
Table 25 : ESG Risk Ratings Metric, by Company, 2022
Table 26 : Global Market for Printed Circuit Boards, by PCB Type, Through 2029
Table 27 : Global Market for PCBs, by PCB Type, Through 2029
Table 28 : Global Market for PCBs, by Region, Through 2029
Table 29 : ESG Risk Ratings, by Company, 2023
List of Figures
Figure 1 : Global Market Shares of Chiplets, by Region, 2023
Figure 2 : Emerging Chiplet Technologies
Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
Figure 4 : Global Market Shares of Chiplets, by Region, 2023
Figure 5 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
Figure 6 : Front-End Fabrication Equipment Spending, 2020-2024
Figure 7 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
Figure 8 : Global Market Shares of Thin and Ultrathin Films, by Region, 2022
Figure 9 : Global Market Shares of IoT Chips, by End-use Industry, 2022
Figure 10 : Global Market Shares of IoT Chips, by End-use Industry, 2022
Figure 11 : Global Market Shares of IoT Chips, by Region, 2022
Figure 12 : Global Market Shares of High-Speed Data Converters, by Type, 2023
Figure 13 : Global Market Shares of High-Speed Data Converters, by Type, 2023
Figure 14 : Global Market Volume Shares of High-Speed Data Converters, by Type, 2022
Figure 15 : Global Market Shares of High-Speed Data Converters, by Region, 2023
Figure 16 : Global Market Volume Shares of High-Speed Data Converters, by Region, 2023
Figure 17 : Global Market Shares of Printed Circuit Boards, by PCB Type, 2023
Figure 18 : Global Market Shares of PCBs, by PCB Type, 2023
Figure 19 : Global Market Shares of PCBs, by Region, 2023
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